预变形TA15合金脉冲电处理球化行为研究  

Globularization Behavior of Pre-deformed TA15 Alloy Subjected to Electric Pulse Treatment

作　　者：严思梁 时迎宾 张晓丽 李萍[1] 薛克敏[1] Yan Siliang;Shi Yingbin;Zhang Xiaoli;Li Ping;Xue Kemin(School of Materials Science and Engineering,Engineering Research Center of High Performance Copper Alloy Materials and Processing,Ministry of Education,Hefei University of Technology,Hefei 230009,China;State Key Laboratory of Materials Processing and Die&Mould Technology,Huazhong University of Science and Technology,Wuhan 430074,China)

机构地区：[1]合肥工业大学材料科学与工程学院高性能铜合金材料及成形加工教育部工程研究中心,安徽合肥230009 [2]华中科技大学材料成形与模具技术国家重点实验室,湖北武汉430074

出　　处：《稀有金属材料与工程》2023年第5期1783-1790,共8页Rare Metal Materials and Engineering

基　　金：国家自然科学基金(51705119,51975175);材料成形与模具技术国家重点实验室开放课题(P2021-015);陕西省高性能精确成形技术与装备重点实验室开放课题(PFTE-2020-KF-01)。

摘　　要：开展了预变形片层组织TA15合金电脉冲处理实验,对片层组织形貌及位错、界面结构进行表征,深入分析预变形片层组织TA15合金在脉冲电流作用下的微观组织演变机理。结果表明,电脉冲促进TA15合金中的原子扩散和缺陷反应,从而使片层组织发生电致静态球化;且随着电流密度增大和通电时间的延长,片层组织球化率增大,平均晶粒尺寸先增大后减小。α相球化前期由末端迁移机制控制,后期受晶界分离和Ostwald熟化控制,而β相球化的主要机制是晶界分离。电脉冲处理后球化α相的新生界面强化导致材料硬度最大提升26.41%。Electric pulse treatment experiments were carried out on lamellar structure TA15 alloy subsequent to pre-deformation.Then,the morphologies of lamellar structure,dislocation structure and interfacial structure were characterized,and the microstructure evolution mechanisms of pre-deformed TA15 alloy with lamellar structure under the action of electric pulses were analyzed.Results show that electric pulse promotes the atom diffusion and defect reactions in TA15 alloy,and introduces the electricity-induced static globularization.With the increase in current density and energization time,the globularization rate of lamellar structure increases and the average grain size ofαlamella first increases and then decreases.Termination migration is regarded as the main mechanism for the earlier stage ofαlamella globularization,while boundary splitting and Ostwald ripening dominate in the later stage.Moreover,the main globularization mechanism forβmatrix is determined as boundary splitting.The additional interfacial strengthening brought by the globularizedαphase leads to a maximum micro-hardness increment of 26.41%.

关 键 词：电脉冲处理 TA15合金 预变形 片层球化 

分 类 号：TG146.23[一般工业技术—材料科学与工程]