半导体芯片用5N级微米导电金球的制备  

Preparation of 5N Micron Conductive Gold Spheres for Semiconductor Chips

作　　者：应宗波 YING Zongbo(Fujian Zijin Precious Metal Materials Co.,Ltd.,Shanghang 364200,China)

机构地区：[1]福建紫金贵金属材料有限公司,福建上杭364200

出　　处：《有色金属工程》2023年第6期26-30,共5页Nonferrous Metals Engineering

基　　金：厦门市重大科技项目(3502720201010)。

摘　　要：微米球形金属粉制备技术已经成为芯片、医疗诊断、3D打印等领域共性的“卡脖子”技术。采用“全湿法制粉+等离子球化”工业制备高纯导电金球,以自产的Au-99.999%为原料,水合肼作为还原剂,PVP作为稀散剂,控制还原电势在1 692~1 002 mV,制得高纯高分散金粉,经气流破碎、等离子球化得到半导体芯片用5N级微米导电金球。该方法目前已经实现工业化10 kg批次量产,初步解决国产芯片封装用导电金球被国外卡脖子的问题,为完善我国芯片研发产业链特别是电子级金原料研发作出重要贡献。The preparation technology of micron spherical metal powder has become a common problem in the fields of chip,medical diagnosis,and 3D-printing.In this paper,micron spherical gold powder was prepared by hydrometallurgy process,and high-purity conductive gold ball was prepared by plasma spheroidizing method.The high-purity and highly dispersed gold powder was prepared with the self-made Au-99.999%as raw material,hydrazine hydrate as reducing agent and PVP as diluent,and the reduction potential was controlled at 1692~1002 mV,5N micron conductive gold spheres for semiconductor chips are obtained by gas flow crushing and plasma spheroidizing.At present,this method has realized industrialized production of 10 kg,preliminarily solved the problem that the conductive gold ball for domestic chip packaging was monopolized by other countries,and made an important contribution to improving China′s chip R&D industry chain,especially the research and development of electronic grade gold raw materials.

关 键 词：半导体芯片 5N级 金粉 微米导电金球 等离子球化 

分 类 号：TB34[一般工业技术—材料科学与工程]