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作 者:朱明伟 李翔 刘宇 ZHU Mingwei;LI Xiang;LIU Yu(BGRIMM MTC Technology Co.,Ltd.,Beijing 102628,China;China Certification&Inspection Group Fujian Co.,Ltd.,Fuzhou 350015,China)
机构地区:[1]北矿检测技术股份有限公司,北京102628 [2]中国检验认证集团福建有限公司,福建福州350015
出 处:《冶金分析》2023年第5期61-66,共6页Metallurgical Analysis
基 金:“十四五”国家重点研发计划项目(2021YFC2903100)。
摘 要:研究了非集成电子器件废旧电路板制样流程对铜含量检测结果精密度和正确度的影响,试验采用二元成对测定及单个测定的方法对样品中铜含量检测结果精密度进行分析,提出粗破、细破、缩分、预干燥、研磨的优化后的制样流程。试验结果表明影响非集成电子器件废旧电路板制样精密度的因素主要是0.15 mm(100目)的过筛率,采用双辊刀盘式剪切破碎机粗破与锤片式粉碎机细破结合的两级破碎方式破碎制样效果最佳。通过提高振动式圆盘磨样机的转速至1 200 r/min,延长研磨时间至180 s和研磨前对样品进行预干燥,能有效降低非集成电子器件废旧电路板研磨过筛后的“软团聚”现象,提高100目过筛率至98%,从而提高制样精密度。优化后的制样流程具有较好精密度和正确度,能够满足非集成电子器件废旧电路板中铜含量检测的需要。The influence of sample preparation process of waste circuit boards of non-integrated electronics on the precision and trueness of copper content testing results was studied.Binary pairs measurement and single testing were adopted to analyze the precision of copper content testing results in experiments.The optimized preparation process including crushing,fine crushing,division,pre-drying,and grinding was proposed.The test results showed that the main factor affecting the precision of sample preparation of non-integrated electronics waste circuit boards was the sieving rate of 0.15 mm(100-mesh).The best preparation effect could be reached by two-stage crushing combination,i.e.,crushing by double roll cutter shear crusher and fine crushing by slice hammer smasher.By increasing the rotate speed of the vibrating disc-mill machine to 1200 r/min,prolonging the grinding time to 180 s,and adopting the pre-drying process for sample before grinding,the phenomenon of"weak agglomerate"after grinding and sieving of non-integrated electronics waste circuit board could be effectively reduced.The sieving rate of 100-mesh was increased to 98%,thus improving the sample preparation precision.The optimized preparation process had good precision and trueness,which could meet the testing requirements of copper content in waste circuit boards of non-integrated electronics.
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