金属离子杂质对电镀锡过程的动力学影响研究  

Effect of Impurity Ions on the Kinetics of Tin Electroplating Process

作　　者：陈世宏 任浩文 杨柏斌 陈思源 郭勇[1] 罗春晖[1] 赵强[1] CHEN Shihong;REN Haowen;YANG Baibin;CHEN Siyuan;GUO Yong;LUO Chunhui;ZHAO Qiang(School of Chemical Engineering,Sichuan University,Chengdu 610065,Sichuan,China;Sichuan Huaci Technology Co.,Ltd.,Suining 629000,Sichuan,China)

机构地区：[1]四川大学化学工程学院,四川成都610065 [2]四川华瓷科技有限公司,四川遂宁629000

出　　处：《四川化工》2023年第3期1-3,20,共4页Sichuan Chemical Industry

基　　金：川大-遂宁校市合作科技项目“增加电镀锡层致密性方法及动力学”(2021CDSN-06)。

摘　　要：锡镀层具有优良的抗腐蚀性能及可焊性,被广泛用作电子元器件的保护性和可焊接性镀层。随着电子信息技术的发展,对电镀锡镀层质量也有了更高的要求。在电镀锡过程中,镀液成分及含量是保证镀层质量的关键。随着镀液使用时间的推移,镀液中的金属离子杂质浓度会逐渐增大,当镀液中的金属离子杂质达到一定浓度后,就会对镀层质量产生较大的影响。采用旋转环盘电极研究在电镀过程中两种主要的金属离子杂质(Fe2+、Ni2+)对锡离子还原动力学的影响,进一步解释了金属离子杂质导致锡镀层质量差的原因,研究结果对电镀锡工艺开发以及过程控制具有一定的指导意义。Tin coating has excellent corrosion resistance and solderability,and is widely used as a protective and solderable coating for electronic components.With the development of electronic information technology,there are also higher requirements for the quality of electroplated tin coatings.In the process of electroplating tin,the composition and content of the plating solution are the key to ensuring the quality of the coating.As the plating solution is used for a long time,the concentration of metal ion impurities in the plating solution will gradually increase.When the metal ions in the plating solution reach a certain concentration,it will have a significant impact on the quality of the coating.The influence of two main metal ion impurities(Fe2+,Ni2+)on the kinetics of tin ion reduction during the electroplating process was studied using a rotating ring disk electrode.This further explained the reason for the poor quality of tin coating caused by metal ion impurities.The research results have certain guiding significance for the development of electroplating tin technology and process control.

关 键 词：电镀锡 金属离子杂质 旋转环盘电极 线性扫描伏安法 循环伏安法 动力学影响研究 

分 类 号：TM53[电气工程—电器] TQ153.13[化学工程—电化学工业]