传感器用多孔铜陶瓷基板的制备方法研究  

Study of Preparation Method of Porous Copper Alumina Substrate for Sensors

作　　者：张富启 侯美珍 赵强 徐鑫雅 ZHANG Fu-qi;HOU Mei-zhen;ZHAO Qiang;XU Xin-ya(Zhuhai Yueke Jinghua Technology Co.,Ltd.,Zhuhai 519050,China;College of Materials Science and Technology,Nanjing University of Aeronautics and Astronautics,Nanjing 210016,China)

机构地区：[1]珠海粤科京华科技有限公司,珠海519050 [2]南京航空航天大学材料科学与技术学院,南京210016

出　　处：《佛山陶瓷》2023年第6期11-14,33,共5页Foshan Ceramics

摘　　要：为制得可用于传感器的高比表面积、高可靠性多孔铜氧化铝基板,使用厚膜涂布工艺,在氧化铝基板上印制了氧化铜厚膜并高温烧结,之后在不同温度下还原,制备了具有不同比表面积的多孔铜层。采用DTA测试了氧化铜浆料烧结过程中的物理化学变化,使用SEM观察了不同温度还原得到的多孔铜层的微观结构。使用XRD表征了界面层的物相组成,还测试了不同还原温度制备多孔铜层的附着强度。结果表明,随着还原温度的升高,多孔铜层的比表面积和附着强度逐渐减小。还原温度为400℃的多孔铜层比表面积最大,且力学性能最好。最后根据热力学分析还原温度对反应层的相组成和对剥离强度的影响,通过界面层的物相组成分析了铜层的失效机理。In order to prepare a porous copper-alumina substrate with high specific surface area and high reliability that can be used for sensors,a thick film of copper oxide is printed on the aluminum oxide substrate using a thick film coating process and sintered at high temperature.After reduction at different temperatures,porous copper layers with different specific surface areas are prepared.The physicochemical changes during the sintering process of the copper oxide slurry are tested by DTA,the microstructure of the porous copper layer obtained by reduction at different temperatures is observed by SEM,the phase composition of the interface layer is characterized by XRD,and the adhesion strength of porous copper layers prepared at different reduction temperatures is tested.The results show that the specific surface area and adhesion strength of the porous copper layer gradually decrease with the increase of the reduction temperature.Consequently,the porous copper layer with the reduction temperature of 400℃ has the largest specific surface area and the best mechanical properties.Finally,according to the thermodynamic analysis of the effect of reduction temperature on the phase composition of the reaction layer and the peel strength,the failure mechanism of the copper layer is analyzed by the phase composition of the interface layer.

关 键 词：氧化铝 多孔铜 烧结机理 还原温度 力学性能 

分 类 号：TQ174.6[化学工程—陶瓷工业] TP212[化学工程—硅酸盐工业]