导热/吸波一体化高分子复合材料的研究进展和机理分析  

Advances and mechanisms in polymer composites toward thermal conduction and electromagnetic wave absorption

作　　者：郭永强 阮坤鹏 王广胜 顾军渭 Yongqiang Guo;Kunpeng Ruan;Guangsheng Wang;Junwei Gu(School of Chemistry,Beihang University,Beijing 100191,China;Shaanxi Key Laboratory of Macromolecular Science and Technology,School of Chemistry and Chemical Engineering,Northwestern Polytechnical University,Xi’an 710072,China)

机构地区：[1]School of Chemistry,Beihang University,Beijing 100191,China [2]Shaanxi Key Laboratory of Macromolecular Science and Technology,School of Chemistry and Chemical Engineering,Northwestern Polytechnical University,Xi’an 710072,China

出　　处：《Science Bulletin》2023年第11期1195-1212,M0004,共19页科学通报（英文版）

基　　金：supported by the National Natural Science Foundation of China(U21A2093,51973173,and 52073010);Kunpeng Ruan would like to thank the Innovation Foundation for Doctor Dissertation of Northwestern Polytechnical University(CX2022073)。

摘　　要：高分子复合材料由于其功能多样、性能稳定、可加工性强等优点,在电子电气领域具有重要的应用.随着5G时代电子产品的小型化和高功率化发展,导致其狭小内部空间的热积聚和电磁波辐射问题愈发严重,传统解决方法是分别使用导热和电磁波吸收功能高分子复合材料,但是难以满足电子产品的小型化、轻薄化发展趋势对多功能一体化材料的迫切需求.因此,设计制备导热/吸波一体化高分子复合材料对于解决电子产品热积聚和电磁污染问题、适应电子产品发展趋势至关重要.本综述总结了导热/吸波一体化高分子复合材料的最新研究成果,分析了影响其导热/吸波性能的因素,并对其导热/吸波机理做了深入的剖析.着重讨论了制约导热/吸波一体化高分子复合材料发展的若干因素,并针对性地提出了解决方案和发展方向,旨在为高性能导热/吸波一体化高分子复合材料发展提供参考价值.Polymer composites have essential applications in electronics due to their versatility,stable performance,and processability.However,with the increasing miniaturization and high power of electronics in the 5G era,there are significant challenges related to heat accumulation and electromagnetic wave(EMW)radiation in narrow spaces.Traditional solutions involve using either thermally conductive or EMW absorbing polymer composites,but these fail to meet the demand for multi-functional integrated materials in electronics.Therefore,designing thermal conduction and EMW absorption integrated polymer composites has become essential to solve the problems of heat accumulation and electromagnetic pollution in electronics and adapt to its development trend.Researchers have developed different approaches to fabricate thermal conduction and EMW absorption integrated polymer composites,including integrating functional fillers with both thermal conduction and EMW absorption functions and innovating processing methods.This review summarizes the latest research progress,factors that affect performance,and the mechanisms of thermal conduction and EMW absorption integrated polymer composites.The review also discusses problems that limit the development of these composites and potential solutions and development directions.The aim of this review is to provide references for the development of thermal conduction and EMW absorption integrated polymer composites.

关 键 词：高分子复合材料 电子产品 吸波机理 多功能一体化 电磁波吸收 电磁波辐射 电磁污染 电子电气 

分 类 号：TB332[一般工业技术—材料科学与工程]