动、静态RRC工艺效果对比  

Comparison of the Effects of Dynamic and Static RRC Processes

作　　者：孙洪君 张晨阳 关丽 吕强 边疆 Sun Hongjun;Zhang Chenyang;Guan Li;Lyu Qiang;Bian Jiang(Shenyang Core Source Microelectronics Equipment Co.,Ltd.,Shenyang Liaoning 110168)

机构地区：[1]沈阳芯源微电子设备股份有限公司,辽宁沈阳110168

出　　处：《现代工业经济和信息化》2023年第5期275-276,280,共3页Modern Industrial Economy and Informationization

摘　　要：RRC(Reducing Resist Consumption)在工艺涂覆过程中,经常用作光刻胶溶剂,用来减少光刻胶的使用量,还可以降低光刻胶中包含的微观气泡数量,对后续的显影、刻蚀等工艺具有明显的优化作用。现阶段常用的RRC涂覆方式有两种:一种称为静态RRC,即衬底静止不动;一种称为动态RRC,即衬底以一定速度旋转。通过几组工艺实验,简单对比了静态RRC与动态RRC的工艺效果,以供大家在以后的工艺制程中进行选择和分析使用。RRC(Reducing Resist Consumption)is often used as a photoresist solvent in the process of coating to reduce the amount of photoresist used and also to reduce the number of microscopic bubbles contained in the photoresist,which has obvious optimization effects on the subsequent processes such as developing and etching.There are two types of RRC coating methods commonly used at this stage:one is called static RRC,where the substrate is stationary,and the other is called dynamic RRC,where the substrate rotates at a certain speed.This paper briefly compares the process effects of static RRC and dynamic RRC through several sets of process experiments,for your selection and analysis in future processes.

关 键 词：RRC(Reducing Resist Consumption) 静态RRC 动态RRC 

分 类 号：TN405[电子电信—微电子学与固体电子学]