我国半导体行业跨国并购绩效分析——以长电科技并购星科金朋为例  

Performance Analysis of Cross Border Mergers and Acquisitions in China's Semiconductor Industry——Taking Changdian Technology's Acquisition of STATSChipPAC as an Example

作　　者：丁可 Ke Ding(East China Jiaotong University,Nanchang,Jiangxi,330000,China)

机构地区：[1]华东交通大学,江西南昌330000

出　　处：《经济管理学刊（中英文版）》2023年第1期74-81,共8页Economic Management Journal

摘　　要：半导体行业与GDP的增长有较为密切的联系,我国集成电路近年来迅猛发展,但是整体技术水平与国外企业还是具有一定差距。本文以全球封测行业排名第三长电科技并购星科金朋为例,基于事件研究法与平衡计分卡法研究此次并购绩效,探究我国半导体行业跨国并购绩效分析。The semiconductor industry is closely related to the growth of GDP.Although China's integrated circuits have developed rapidly in recent years,there is still a certain gap in overall technological level compared to foreign enterprises.This paper takes the acquisition of STATSChipPAC by Changdian Technology,which ranks the third in the global seal test industry,as an example,to study the performance of this acquisition based on the Event study method and the Balanced scorecard method,and explore the performance analysis of cross-border mergers and acquisitions in China's semiconductor industry.

关 键 词：跨国并购 并购绩效 事件研究法 平衡记分卡法 

分 类 号：F27[经济管理—企业管理]