检索规则说明:AND代表“并且”;OR代表“或者”;NOT代表“不包含”;(注意必须大写,运算符两边需空一格)
检 索 范 例 :范例一: (K=图书馆学 OR K=情报学) AND A=范并思 范例二:J=计算机应用与软件 AND (U=C++ OR U=Basic) NOT M=Visual
作 者:王明明 徐子轩 王守豪 郑浩[3] 刘振宇 刘俐 Wang Mingming;Xu Zixuan;Wang Shouhao;Zheng Hao;Liu Zhenyu;Liu Li(Wuhan Representative Bureau of Naval Department of Equipment,Wuhan 430022,China;School of Materials Science and Engineering,Wuhan University of Technology,Wuhan 430070,China;China Ship Development and Design Center,Wuhan 430064,China)
机构地区:[1]海装驻武汉地区军事代表局,湖北武汉430022 [2]武汉理工大学材料科学与工程学院,湖北武汉430070 [3]中国舰船研究设计中心,湖北武汉430064
出 处:《电镀与精饰》2023年第7期26-32,共7页Plating & Finishing
基 金:国家自然科学基金项目(编号:62004144,61904127)。
摘 要:为了在微电子器件内凸点下金属化层设计中广泛应用镍基镀层,需要具备良好的润湿性和结合强度。本研究采用电化学表面沉积技术,在金属铜基板上制备了具有不同表面形貌的镍基镀层,并建立了电流密度与镀层表面形貌、均匀性之间的关系。通过系统研究不同镍基镀层上锡基焊球的润湿角和焊点抗剪切强度,发现在电流密度为2.00 A/dm^(2)时制备的镀层表现出最佳表面性能,焊点抗剪切强度可达92.6 MPa。此时,镀层表面呈现金字塔状的镍颗粒,润湿角为75°。Nickel-based coatings are extensively employed in the design of metallized layers for microelectronic devices,which require excellent wettability and bonding strength.In this study,nickel coatings with different surface morphologies were prepared on copper substrates using electroplating technology.The relationship between current density and surface morphology and uniformity of nickelbased coatings was established.Furthermore,the wetting angle and shear strength of solder joints on different nickel-based coatings were systematically investigated.The findings indicate that the coating prepared at a current density of 2.00 A/dm^(2)exhibits superior surface performance,with a maximum shear strength of 92.6 MPa and pyramid-shaped nickel particles on the coating surface.Additionally,the wetting angle of this coating is 75°.
关 键 词:电化学沉积 表面形貌 润湿角 剪切强度 断面形貌
分 类 号:TQ153[化学工程—电化学工业]
正在载入数据...
正在载入数据...
正在载入数据...
正在载入数据...
正在载入数据...
正在载入数据...
正在载入数据...
正在链接到云南高校图书馆文献保障联盟下载...
云南高校图书馆联盟文献共享服务平台 版权所有©
您的IP:216.73.216.49