基于冷烧结技术的微波介质陶瓷研究进展  

Research Progress on Microwave Dielectric Ceramics Based on Cold Sintering Process

作　　者：陈乃超 程进 汪宏 CHENNaichao;CHENG Jin;WANG Hong(Department of Materials Science and Engineering,Southern University of Science and Technology,Shenzhen 518055,Guangdong,China)

机构地区：[1]南方科技大学材料科学与工程系,广东深圳518055

出　　处：《硅酸盐学报》2023年第4期889-898,共10页Journal of The Chinese Ceramic Society

基　　金：国家自然科学基金重大研究计划重点支持项目(92066208);深圳市海内外高层次创新创业团队(KQTD20180411143514543)。

摘　　要：微波介质陶瓷作为介质材料被广泛应用于物联网、工业互联网、5G通信、全球卫星通信系统的无源器件中.从微波介质陶瓷的研究背景出发,介绍了冷烧结的致密机理和工艺参数,总结了冷烧结微波介质陶瓷的主要材料体系和器件,指出了冷烧结微波介质陶瓷的主要问题和发展前景.冷烧结技术具有烧结温度低(<300℃)、可共烧异质材料、烧结前后晶粒尺寸差异小、制备工艺简单、节能环保等多种优点,在多层共烧陶瓷和微波系统集成方面具有潜在应用.Microwave dielectric ceramics are widely used as dielectric materials in passive devices of the internet of things,industrial internet,5G communications,and global satellite communication systems.This review introduced the densify mechanism and process parameters of cold sintering process.The main material systems and devices of cold sintered microwave dielectric ceramics were summarized.The main challenges and prospections of cold sintered microwave dielectric ceramics were pointed out.Cold sintering process has some advantages of low sintering temperature(<300 C),co-firing heterogeneous materials,small grain size difference before and after sintering,simple preparation process,energy saving and environmental protection,etc.,which has potential applications in multi-layer co-fired ceramics and microwave system integration.

关 键 词：冷烧结 微波介质陶瓷 微波器件 微波性能 

分 类 号：TQ174[化学工程—陶瓷工业]