微波毫米波用低介电常数低温共烧陶瓷研究进展  

Recent Progress on Low-Permittivity LTCC for Microwave/Millimeter Wave Applications

作　　者：王威[1] 张玲[1,2] 吴亚光 乔峰 史忠旗 刘文凤 周迪 WANG Wei;ZHANG Ling;WU Yaguang;QIAO Feng;HI Zhongqi;LIU Wenfeng;ZHOU Di(School of Electronic and Information Engineering,Faculty of Electronic and Information Engineering,Xi'an Jiaotong University,Xi'an 710049,China;Chengdu Hongke Electronic Technology Company Limited,Chengdu 610101,China;Hebei Institute of Semiconductor,Shijiazhuang 050051,China;School of Materials Science and Engineering,Xi'an Jiaotong University,Xi'an 710049,China;School of Electrical Engineering,Xi'an Jiaotong University,Xi'an 710049,China)

机构地区：[1]西安交通大学电信学部电子科学与工程学院,西安710049 [2]成都宏科电子科技有限公司,成都610101 [3]河北半导体研究所,石家庄050051 [4]西安交通大学材料科学与工程学院,西安710049 [5]西安交通大学电气工程学院,西安710049

出　　处：《硅酸盐学报》2023年第4期934-948,共15页Journal of The Chinese Ceramic Society

基　　金：国家自然科学基金项目(51972260,52072295);陕西省重点研发计划国际合作项目(2021KWZ-10);中央高校基本科研业务费。

摘　　要：在新一代高速无线通信技术推动下,低温共烧陶瓷技术(LTCC)正处于重大变革时期.采用低介电常数(K)、低损耗、谐振频率温度稳定型LTCC作为高频基板材料,可以满足无线技术高速率、低延时、高可靠的需求,是当前热点研究之一.因此商用基板材料的现状和一些候选材料的研究工作被主要评述,重点对玻璃/陶瓷体系、氧化物助烧体系、氟化物助烧体系、本征低温烧结体系等低K值LTCC材料的组成、结构特征、介电性能、热膨胀系数等具体指标及相应优缺点进行了讨论.同时介绍了一些热门体系的改性工作及其毫米波适用性,最后对未来低K值LTCC材料的发展进行展望.With the development of a high-speed wireless technology,low-temperature co-fired ceramics(LTCC)technology becomes popular.The high-speed,low-delay and high-reliable wireless transmission could be achieved by using LTCC substrates with a low-permittivity(K),a low-loss and a stable-temperature of resonant frequency,as one of functional materials.This review introduced the current situation of commercial substrate materials and alternative LTCCs reported,i.e.,ceramic/glass,oxide-assisted sintering,fluoride-assisted sintering and intrinsic low-sintering ceramic systems.The composition,structural characteristics,dielectric properties,coefficient of thermal expansion of low-K LTCCs,as well as the advantages and disadvantages,were also discussed.Some studies of commercial substrates were further described,and their performances in millimeter-wave application were represented.In addition,the development trend of low-K LTCCs was also proposed.

关 键 词：微波/毫米波 高频基板 低介电常数 低温共烧陶瓷技术 介电性能 

分 类 号：TQ174[化学工程—陶瓷工业]