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作 者:任杰 甄贞 靳思玥 韩海龙 原蒲升 李凌云[3,4] 尤立星[3,4] 王镇[3,4] 许兴胜[1,2] REN Jie;ZHEN Zhen;JIN Si-Yue;HAN Hai-Long;YUAN Pu-Sheng;LI Ling-Yun;YOU Li-Xing;WANG Zhen;XU Xing-Sheng(State Key Laboratory of Integrated Optoelectronics,Institute of Semiconductors,Chinese Academy of Sciences,Beijing 100083,China;Center of Materials Science and Optoelectronics Engineering,University of Chinese Academy of Sciences,Beijing 100049,China;State Key Lab of Functional Materials for Informatics,Shanghai Institute of Microsystem and Information Technology(SIMIT),Chinese Academy of Sciences,Shanghai 200050,China;CAS Center for Excellence in Superconducting Electronics(CENSE),Shanghai 200050,China)
机构地区:[1]中国科学院半导体研究所,集成光电子学国家重点实验室,北京100083 [2]中国科学院大学材料与光电研究中心,北京100049 [3]中国科学院上海微系统与信息技术研究所,信息功能材料国家重点实验室,上海200050 [4]中国科学院超导电子学卓越创新中心,上海200050
出 处:《红外与毫米波学报》2023年第3期377-382,共6页Journal of Infrared and Millimeter Waves
基 金:Projects were supported by the National Natural Science Foundation of China (61875252,92165202);the Strategic Priority Research Program (A) of Chinese Academy of Sciences (XDA18040300)。
摘 要:封装是光电子器件的关键技术之一。同时,器件的封装还影响器件的性能。文章提出了一种基于波长滞后的方法来评估激光器在298 K至10 K环境温度范围内的热阻。通过计算降温和升温过程中波长滞后的程度来表征热阻大小。该方法解决了低温环境中无法评估激光器散热性能的问题。这对低温光互连具有重要意义,也为低温环境中激光器的封装设计提供了参考。Packaging is one of the key technologies of optoelectronic devices.It also determines the performance of the packaged device.In the article,a method based on wavelength hysteresis is proposed to evaluate the thermal resistance of the laser at ambient temperatures from 298 K to 10 K.The thermal resistance is characterized by calculating the value of wavelength hysteresis during the cooling and heating process.This method solves the problem that the heat dissipation performance of the laser cannot be evaluated at low temperatures.This is of great significance to the optical interconnection at low temperatures.It also provides a reference for the package design of lasers in a low-temperature environment.
分 类 号:O514.2[理学—低温物理] O433[理学—物理] O4-34[机械工程—光学工程] O551.1[理学—光学] O47
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