高导热环氧模塑料的制备  

Preparation of Epoxy Molding Compound with High Thermal Conductive

作　　者：段杨杨 谭伟 李兰侠 刘红杰 范丹丹 刘玲玲 崔亮 蒋小娟 DUAN Yangyang;TAN Wei;LI Lanxia;LIU Hongjie;FAN Dandan;LIU Lingling;CUI Liang;JIANG Xiaojuan(Jiangsu Huahai Chengke Advanced Material Co.,Ltd.,Lianyungang 222047,China)

机构地区：[1]江苏华海诚科新材料股份有限公司,江苏连云港222047

出　　处：《电子工业专用设备》2023年第3期19-21,36,共4页Equipment for Electronic Products Manufacturing

摘　　要：介绍了导热系数大于3 W/(m·K)高导热环氧模塑料的制备。以低黏度多芳香环(MAR)环氧树脂和MAR酚醛树脂为基体,以偶联剂处理的球形氧化铝做导热填料,磷类做催化剂,经高速混合机混合、双螺杆挤出机挤出,合成高导热环氧模塑料。并研究了不同偶联剂类型对弯曲强度的影响。通过改变填充量至93%,导热系数最高可达5.6 W/(m·K),且有较好的弯曲性能和流动性能。Preparation of epoxy molding compound(EMC) with thermal conductive greater than 3 W/(m·K) is introduced.Using multi-aromatic epoxy resin and multi-aromatic phenolic resin as matrix,and spherical alumina treated with coupling agent is used as a thermal filler and Phosphorus as a catalyst,by means of high-speed premixure and twin-screw extruder,the high thermal conductive EMC is obtained.Effects of different coupling agent on flexural strength are researched also.In addition,by adjusting the filler content to 93%,the thermal conductive could be up to 5.6 W/(m·K).Meanwhile,EMC remains good fluidity and bending properties.

关 键 词：高导热 环氧模塑料 氧化铝 

分 类 号：TN305.94[电子电信—物理电子学]