聚酰亚胺导热材料的制备研究进展  

Progress in Preparation of Thermally Conductive Polyimide Materials

作　　者：李沐坤 郭永强 阮坤鹏 顾军渭 LI Mu-kun;GUO Yong-qiang;RUAN Kun-peng;GU Jun-wei(Queen Mary University of London Engineering School,Northwestern Polytechnical University,Xi’an 710072,China;School of Chemistry,Beihang University,Beijing 100083,China;School of Chemistry and Chemical Engineering,Northwestern Polytechnical University,Xi’an 710072,China)

机构地区：[1]西北工业大学伦敦玛丽女王大学工程学院,西安710072 [2]北京航空航天大学化学学院,北京100083 [3]西北工业大学化学与化工学院,西安710072

出　　处：《高分子通报》2023年第8期979-997,共19页Polymer Bulletin

基　　金：国家自然科学基金面上项目(51973173);西北工业大学2022年度博士论文创新基金(CX2022073);西北工业大学2022年度大学生创新创业训练计划项目(S202210699381)。

摘　　要：聚酰亚胺(PI)具有优异的绝缘性能、力学性能、耐热性能、耐辐射性能等,广泛应用于高精密智能控制系统、5G通讯终端与基站等领域。但PI材料的导热系数(λ)较低,无法满足当下及未来高功率电子电气设备的导热/散热需求。因此,研究开发新一代PI导热材料成为国内外的研究热点。本文系统总结了PI导热材料的研究进展,主要从本征型导热PI和PI导热复合材料两方面展开,介绍了相关概念、分类与影响因素,阐述了PI导热材料的制备及研究进展,分析了PI导热材料的内禀导热机理,最后总结了该领域内目前面临的挑战、展望了PI导热材料的发展方向。Polyimide(PI)has excellent insulation properties,mechanical properties,heat resistance,radiation resistance,etc.,and is widely used in high-precision intelligent control systems,5G communication terminals and base stations.However,the thermal conductivity coefficients(λ)of PI materials are low,which cannot meet the thermal conductivity/heat dissipation requirements of current and future high-power electronic and electrical equipment.Therefore,research and development of the new generation of thermally conductive PI materials has become a research hotspot at home and abroad.This review systematically summarizes the research progress of thermally conductive PI materials,mainly from two aspects:intrinsically thermally conductive PI and thermally conductive PI composites.Related concepts,classifications and influencing factors are introduced,the preparation and research progress of thermally conductive PI materials are expounded,and the thermal conduction mechanisms of thermally conductive PI materials are analyzed.Finally,the current challenges in this field are summarized,and the development directions of thermally conductive PI materials are prospected.

关 键 词：聚酰亚胺 本征导热 导热复合材料 导热系数 

分 类 号：TN04[电子电信—物理电子学] TQ323.7[化学工程—合成树脂塑料工业]