航电产品印制板组件三防材料发展趋势  

Development Trend of Multi-purpose Protective Materials for Avionics Printed Board Components

作　　者：王晨[1] 丁诗炳 何云飞 李德雄[1] WANG Chen;DING Shi-bing;HE Yun-fei;LI De-xiong(China National Aeronautical Radio Electronics Research Institute,Shanghai 200241,China)

机构地区：[1]中国航空无线电电子研究所,上海200241

出　　处：《航空电子技术》2023年第2期57-61,共5页Avionics Technology

摘　　要：航电产品印制板组件在完成电子装配、测试调试等工序后,一般要求喷涂三防涂层等方式进行防护保护,使印制板组件具备防潮湿、防霉菌、防盐雾等特性,保障其能够在复杂使用环境中正常工作。现有使用的航电产品印制板组件三防材料在面向未来产品使用需求时,其固有缺点逐渐显现。随着三防新材料新工艺出现,这一问题可能会得到有效解决。本文介绍航电产品印制板组件防护总体要求与现有三防材料特点,结合近年来三防新材料的发展总结未来三防材料发展趋势。After completing the electronic assembly,testing and debugging,the printed board components of avionics products are generally required to be protected by spraying three anti-coating,so that the printed board components have anti-moisture,anti-mold,anti-salt spray and other protective characteristics to ensure that they can work normally in a complex environment.The inherent shortcomings of the existing tri-proof materials for printed board components of avionics products are gradually emerging when they face the needs of future products.With the emergence of new materials and new processes,this problem may be effectively solved.The general requirements of avionics PCB assem-bly protection and the characteristics of existing tri-proof materials are introduced,and the development trend of tri-proof materials in the future is summarized.

关 键 词：印制板组件 航电产品 防护材料 

分 类 号：V271.492[航空宇航科学与技术—飞行器设计] V243