Cu粉预球磨和烧结工艺对Cu/6061Al界面结构的调控  

Regulation of Cu/6061Al Interfacial Structure by Cu Powder Pre-ball Milling and Sintering Process

作　　者：吴少鹏 蔡晓兰[1] 周蕾[1] 栗文浩 刘旭升 王延坤 WU Shaopeng;CAI Xiaolan;ZHOU Lei;LI Wenhao;LIU Xusheng;WANG Yankun(Faculty of Metallurgical and Energy Engineering,Kunming University of Science and Technology,Kunming 650093,China)

机构地区：[1]昆明理工大学冶金与能源工程学院,昆明650093

出　　处：《材料导报》2023年第14期148-153,共6页Materials Reports

基　　金：云南省高校金属粉体与设备开发科技创新团队支持计划资助(14051693);云南省基础研究重点项目(202001AS070049);云南省重大科技专项计划(202102AB080004)。

摘　　要：本工作采用高能球磨和烧结工艺成功制备了Cu/6061Al扩散对,研究了Cu粉机械球磨对真空热压烧结过程中Cu/6061Al界面处中间相生长的影响。通过XRD、FESEM和电子探针对界面结构以及生成物进行表征。结果表明,在Cu/6061Al界面处出现了三种层状中间相,从Cu侧到6061Al侧依次为Cu_(9)Al_(4)、CuAl和CuAl_(2)相。此外,对比未球磨的样品,经过球磨的样品在Cu基体和Cu_(9)Al_(4)层中出现了大量的孔洞且随着球磨时间的延长而增多。同时,Cu/Cu_(9)Al_(4)界面也随着球磨时间的延长变得模糊。对每种层状金属间化合物而言,机械球磨对金属间化合物层生长的促进作用按从大到小顺序排列为:Cu_(9)Al_(4)、CuAl、CuAl_(2),从Cu侧到6061Al侧呈递减规律。In this work,the Cu/6061Al diffusion pair was successfully prepared by high-energy ball milling and sintering forming process,and the effect of mechanical milling on the growth of the Cu/6061Al intermetallic compound layer at the Cu/6061Al interface during vacuum hot-pressing sintering was studied.The interface structure and products were characterized by XRD,FESEM,and EPMA analysis.The results show that three layers of copper-aluminum intermetallic compounds are observed at the interface,from Cu to the 6061Al side,there are Cu_(9)Al_(4),CuAl,and CuAl_(2) phases in sequence.In addition,compared with the non-ball milled samples,many pores were observed in the Cu and Cu_(9)Al_(4) regions of the samples after ball milling,which increased with the increase of the milling time.At the same time,the Cu/Cu_(9)Al_(4) interface also becomes blurred with the increase of ball milling time.For each layered intermetallic compound,the effect of mechanical milling on the growth of the intermetallic compound layer was in descending order:Cu_(9)Al_(4),CuAl,CuAl_(2),which was decreasing from the Cu side to the 6061Al side.

关 键 词：金属间化合物 机械球磨 Cu/6061Al界面 层状结构 真空热压 

分 类 号：TG111.6[金属学及工艺—物理冶金]