钢化真空玻璃封接工艺及封接接头性能研究  

Sealing process of tempered vacuum glass and performance of sealing joints

作　　者：任鹏凯 徐冬霞[1,2] 徐深深 郑越 张红霞 REN Pengkai;XU Dongxia;XU Shenshen;ZHENG Yue;ZHANG Hongxia(School of Materials Science and Engineering,Henan Polytechnic University,Jiaozuo 454003,China;Engineering Research Center for Structural and Functional Metal Matrix Composites in Henan Province,Jiaozuo 454003,China;Luoyang Land Glass Machinery Co.Ltd.,Luoyang 471000,China)

机构地区：[1]河南理工大学材料科学与工程学院,河南焦作454003 [2]河南省结构功能性金属基复合材料工程技术研究中心,河南焦作454003 [3]洛阳兰迪玻璃机器股份有限公司,河南洛阳471000

出　　处：《兵器材料科学与工程》2023年第4期58-63,共6页Ordnance Material Science and Engineering

基　　金：河南省产学研合作项目(152107000077);校企合作开发项目(H15-108,H21-019)。

摘　　要：用自主研发的Sn-0.3Ag-0.7Cu-0.6Ga-0.8Sb低Ag无铅焊料对覆Ag玻璃基板进行真空封接。封接温度为270、280、290、300℃,保温时间为15、20、25、30 min。通过剪切强度测试、气密性测试、扫描电镜观察及EDS能谱分析对钢化真空玻璃封接接头的性能与组织进行分析。结果表明:封接接头依靠焊料合金中的Sn与Ag层中的Ag相互扩散形成冶金结合。封接接头剪切强度随封接温度上升、保温时间延长先增后降,封接温度为290℃、保温20 min时,接头剪切强度最高,为14.01 MPa,此时接头内部的IMC层组织厚度适中,分布均匀,接头断裂位置位于Ag层与玻璃结合部位,封接接头气密性在该封接工艺下达到最佳,为1×10^(-9)Pa·m^(3)/s。Vacuum sealing of the Ag‐coated glass substrate was achieved using the self‐developed Sn‐0.3Ag‐0.7Cu‐0.6Ga‐0.8Sb low‐Ag lead‐free solder.The holding times were 15,20,25 and 30 minutes,while the sealing temperatures were 270℃,280℃,290℃,and 300℃,respectively.The performance and microstructure of the tempered vacuum glass sealing joints were analyzed by means of shear strength testing,air tightness testing,scanning electron microscope observation and EDS energy spectrum analysis.The results show that the metallurgical bonding forms by the mutual diffusion of Sn element in solder alloy and Ag element in Ag layer.The shear strength of the sealed joints increases firstly and then decreases with the increase of sealing temperature and holding time.When the sealing temperature is 290℃and the holding time is 20 min,the shear strength of the joint is the highest,reaching to 14.01 MPa.At this time,the IMC layer's thickness inside the joint is moderate and evenly distributed.The joint's fracture position is located at the interface between the Ag layer and the glass.The air tightness of the sealing joint is optimal under this sealing process,reaching to 1×10^(-9) Pa·m^(3)/s.

关 键 词：钢化真空玻璃 低Ag无铅焊料 真空钎焊 剪切强度 气密性 

分 类 号：TG425.1[金属学及工艺—焊接]