装配式惯性开关的兆声辅助微电铸均匀性研究  

Study on Uniformity of Assembled Inertial Switch in Megasonic-Assisted Microelectroforming Process

作　　者：杜立群[1,2] 董雅坤 郭柄江 蔡小可 王帅 李经民 DU Liqun;DONG Yakun;GUO Bingjiang;CAI Xiaoke;WANG Shuai;LI Jingmin(Key Laboratory for Precision and Non-Traditional Machining Technology of the Ministry of Education,Dalian University of Technology,Dalian 116024,China;Key Laboratory for Micro/Nano Technology and System of Liaoning Province,Dalian University of Technology,Dalian 116024,China)

机构地区：[1]大连理工大学精密与特种加工教育部重点实验室,大连116024 [2]大连理工大学辽宁省微纳米技术及系统重点实验室,大连116024

出　　处：《航空制造技术》2023年第13期14-21,共8页Aeronautical Manufacturing Technology

基　　金：国家重点研发计划(2020YFB2009002);国家自然科学基金(51975103)。

摘　　要：在装配式惯性开关的电铸过程中,电场的边缘效应干扰了电力线在阴阳极间的均匀分布,导致铸层厚度均匀性问题突显,使得制作周期延长。为了缩短装配式惯性开关的制作周期,将兆声波引入到微电铸过程,以装配式惯性开关中电铸均匀性最差的滑块结构为例,开展改善微电铸层均匀性的研究工作。首先,利用COMSOL仿真分析软件对滑块结构有、无兆声波辅助条件下的微电铸加工过程中的电流密度分布和铸层厚度分布进行仿真。仿真结果表明,相对于无兆声波辅助微电铸加工,兆声波辅助微电铸加工可以有效改善铸层厚度均匀性。兆声波功率密度越大,铸层厚度均匀性越好。在数值模拟的基础上,对兆声波辅助电铸过程展开试验研究。试验结果表明,相对于无兆声波辅助微电铸加工,双向加载2.4 W/cm^(2)的兆声波辅助微电铸加工的铸层厚度均匀性提高了51.78%,试验与仿真结果趋势一致。基于仿真和试验结果,将双向加载2.4 W/cm^(2)的兆声波引入微电铸工艺,制作了总体尺寸20 mm×20 mm、总高度900μm,符合设计要求的装配式惯性开关。与无兆声波辅助微电铸制作完成的装配式惯性开关相比,制作时间缩短了25%。The edge effect of the electric field in the assembled inertial switch electroforming will disturb the uniform distribution of the power lines between the anode and the cathode.This leads to the problem of poor uniformity of electroforming layer thickness,which prolongates the production cycle.In order to shorten the production cycle of the assembled inertial switch,the megasonic is introduced into the microelectroforming process in this paper.The slider structure has the worst electroforming uniformity in the assembled inertial switch.This paper focuses on how to improve the microelectroforming layer uniformity of the slider structure.Firstly,the current density distribution and layer thickness distribution in the process of electroforming process are simulated by COMSOL finite element analysis software.The simulation results indicate that,compared with the electroforming process without megasonic,the thickness of microstructure obtained by megasonic-assisted electroforming is more uniform.With the increase of megasonic power density,the layer thickness uniformity is better.Secondly,on the basis of simulation,megasonic-assisted electroforming experiment is carried out.Compared with the electroforming process without megasonic,the thickness uniformity of the megasonic-assisted microelectroforming with simultaneous left and right vibration and power density is 2.4 W/cm^(2)is improved by 51.78%.The simulation results are basically consistent with the experimental results.According to the above research results,the assembled inertial switch with the size of 20 mm×20 mm and the height of 900μm is made by introducing the simultaneous left and right vibration megasonic with the power density of 2.4 W/cm^(2)into the microelectroforming process.The switch meets the design requirement.Compared with the microelectroforming process without megasonic,the manufacturing time of the assembled inertial switch made by megasonic-assisted microelectroforming is reduced by 25%.

关 键 词：装配式开关 电铸均匀性 兆声波辅助电铸 功率密度 有限元分析 

分 类 号：TQ153.4[化学工程—电化学工业]