含氟PI/氟化石墨烯复合薄膜的制备与性能  

Preparation and Properties of Fluorinated PI/Fluoride Graphene Composite Films

作　　者：陈安华 曾明 李鉴桥 王恒鑫 彭娅[1] Chen Anhua;Zeng Ming;Li Jianqiao;Wang Hengxin;Peng Ya(School of Materials Science and Engineering,Xihua University,Chengdu 610039,China;Chongqing Institute of Food and Drug Inspection,Chongqing 401123,China)

机构地区：[1]西华大学材料科学与工程学院,成都610039 [2]重庆市食品药品检验检测研究院,重庆401123

出　　处：《工程塑料应用》2023年第7期123-128,共6页Engineering Plastics Application

基　　金：教育部“春晖计划”科研项目(Z2010093)。

摘　　要：为了降低聚酰亚胺(PI)薄膜的介电常数及介电损耗,使其满足如5G通信等领域的应用需求,在合成本征型含氟聚酰亚胺(FPI)的基础上引入氟化石墨烯(FG)填料制备了高含氟量PI薄膜。首先采用溶剂热插层辅助超声离心的方法制备了FG填料,利用傅里叶变换红外光谱仪、激光粒度分布仪及X射线衍射仪对制备的FG进行表征,再利用原位聚合法合成了本征型FPI/FG复合薄膜,并对复合薄膜的微观形貌、介电性能、力学性能及耐水性能进行测试,研究不同FG含量对复合薄膜结构与性能的影响。结果表明,成功制备了粒径较小的FG纳米填料和FPI/FG复合薄膜,将FG加入到FPI基体中能有效降低其介电常数,随着FG填料在复合薄膜中质量分数的增大,FPI/FG复合薄膜的介电常数呈现先降低后升高的趋势,当FG质量分数为1.0%时,薄膜具有最低的介电常数2.11及较低的介电损耗(<0.015)。此外由于FG与FPI间较好的相互作用,使得FPI/FG复合薄膜的拉伸性能和耐水性得到一定改善。In order to reduce the dielectric constant and dielectric loss of polyimide(PI)films to meet the requirements of applications such as 5G communication,PI films of high fluorine content were prepared by filling fluorinated graphene(FG)into the intrinsic fluorinated polyimide(FPI)by in-situ polymerization.The FG fillers that were firstly prepared by solvent thermal-intercalation and assisted ultrasonic centrifugation were characterized by Fourier infrared transform spectroscopy,laser particle size distribution,and X-ray diffraction.The intrinsic fluorinated polyimide(FPI)/FG composite films were synthesized by in-situ polym‐erization.The effects of different FG weight contents on the structures and properties of the composites were studied by testing the microscopic morphology,dielectric properties,mechanical properties,and water resistance of the composite films.It is revealed that FG with nanometer size and the intrinsic fluorinated PI composite films are both prepared successfully.The dielectric constant of FPI/FG composite films first reduces and then increases with the FG weight contents.When the weight content of FG is 1.0wt%,the lowest dielectric constant of the FPI/FG reaches up to 2.11 while the dielectric loss is less than 0.015.In addition,the tensile proper‐ties and water resistance of the FPI/FG composite films are improved due to the good interaction between FG and FPI.

关 键 词：聚酰亚胺 氟化石墨烯 复合薄膜 介电性能 综合性能 

分 类 号：TB332[一般工业技术—材料科学与工程]