磷青铜合金接插件连续电镀薄金工艺优化  

Optimization of process for continuous electroplating of thin gold on phosphor bronze connector

作　　者：杨希明 李晓明 龚俊锋 叶繁 龙磊 杨希军 邓南方 邓绍雄 YANG Ximing;LI Xiaoming;GONG Junfeng;YE Fan;LONG Lei;YANG Xijun;DENG Nanfang;DENG Shaoxiong(Fuding Precision Components(Shenzhen)Co.,Ltd.,Foxconn Technology Group,Shenzhen 518110,China)

机构地区：[1]富士康科技集团富顶精密组件(深圳)有限公司,广东深圳518110

出　　处：《电镀与涂饰》2023年第13期58-67,共10页Electroplating & Finishing

摘　　要：通过正交试验对磷青铜基材接插件连续选镀薄金的主要工序进行优化,包括微蚀、电镀填平镍、电镀半光镍、电镀高磷镍、电镀金和封孔。硝酸蒸汽试验结果表明,采用较佳工艺所得电镀金试样的耐蚀性满足电子接插件的要求。实际生产中该工艺的产品合格率在99.5%以上。The operation conditions of the main procedures such as slight etching,filling and leveling nickel electroplating,semi-bright nickel electroplating,high-phosphorus Ni-P alloy electroplating,gold electroplating,and sealing for continuous and selective electroplating of thin gold on phosphor bronze connectors were optimized by orthogonal tests.The nitric acid vapor test results showed that the corrosion resistance of the sample obtained under the optimized conditions met the requirement of electronic connector.The first pass yield of the process was more than 99.5% in mass production.

关 键 词：接插件 连续电镀 薄金 磷青铜 耐蚀性 工艺优化 

分 类 号：TQ153.18[化学工程—电化学工业]