基于绝缘体上硅的颅内压力传感器的设计与制作  

Design and fabrication of intracranial pressure sensor based on SOI

作　　者：钟长志 王凌云 卜振翔 刘路江 谷丹丹 ZHONG Changzhi;WANG Lingyun;BU Zhenxiang;LIU Lujiang;GU Dandan(School of Aerospace Engineering,Xiamen University,Xiamen 361102,China;Pen-Tung Sah Institute of Micro-Nano Science and Technology,Xiamen University,Xiamen 361102,China)

机构地区：[1]厦门大学航空航天学院,福建厦门361102 [2]厦门大学萨本栋微米纳米科学技术研究院,福建厦门361102

出　　处：《厦门大学学报（自然科学版）》2023年第4期517-524,共8页Journal of Xiamen University：Natural Science

基　　金：航空科学基金(201946068005)。

摘　　要：基于当前医疗领域对颅内压(intracranial pressure,ICP)测量的迫切需要,设计并制造了一款量程为-10~50 kPa的绝缘体上硅(silicon-on-insulator,SOI)压阻式压力传感器.根据硅的压阻效应原理和小挠度变形理论,完成了传感器的整体结构设计,采用微电子机械系统(micro-electromechanical systems,MEMS)加工工艺完成了敏感芯片的制备,并结合柔性印刷电路板(flexible printed circuit,FPC)和生物柔性硅胶技术对芯片进行了放大补偿和封装.最后对其进行了压力疲劳循环测试,测试结果表明:FPC封装的压力传感器在常温环境下具有较低的非线性误差、迟滞性和重复性,经过放大后的输出灵敏度可以达到3.706 mV/kPa.Due to the urgent need of intracranial pressure(ICP)measurement in the medical field,a silicon-on insulator(SOI)piezoresistive pressure sensor with a range of-10-50 kPa is designed and fabrication.According to the principle of piezoresistive effect of silicon and the theory of small deflection deformation,the overall structure of the sensor is designed.The sensitive chip was fabricated by MEMS processing technology,and the chip is packaged and compensated by FPC flexible circuit board and biological flexible silica gel technology.Finally,the pressure fatigue cycle test is carried out.Test results show that the pressure sensor packaged in FPC endures low nonlinear errors,hysteresis and repeatability at room temperature,and the output sensitivity can reach 3.706 mV/kPa after amplification.

关 键 词：压力传感器 颅内压(ICP) 微机电系统(MEMS) 压阻效应 柔性印刷电路板(FPC) 

分 类 号：S951.43[农业科学—水产养殖]