电子设备冲击试验滑移问题分析与研究  

Analysis and Research on Sliding Problem in Impact Test of Electronic Equipment

作　　者：阮翔[1] 丁瑞翔 肖伟[1] 林克敏 李杰 RUAN Xiang;DING Rui-xiang;XIAO Wei;LIN Ke-min;LI Jie(The 52nd Research Institute of China Electronics Technology Group Corporation,Hangzhou 31l121)

机构地区：[1]中国电子科技集团公司第五十二研究所,杭州311121

出　　处：《环境技术》2023年第6期152-156,共5页Environmental Technology

摘　　要：研究电子设备冲击试验过程不产生滑移的理论,有助于电子设备夹装技术的发展。本文研究了电子设备冲击试验过程中产生滑移的机理,在受力分析的基础上进行了垫板材料选型,并通过模拟仿真和试验测试进行了验证。总结保证电子设备冲击过程不发生滑移的充分条件,可以有效提高电子设备冲击试验过程的安全性。The research on the theory of no slip during the impact test of electronic equipment is helpful to the development of clamping technology of electronic equipment.In this paper,the mechanism of slippage in the impact test of electronic equipment is studied.Based on the force analysis,the selection of pad is carried out,and verified by simulation and test.The sufficient conditions to ensure no slip in the impact test process of electronic equipment are summarized,which can effectively improve the safety of the impact test process of electronic equipment.

关 键 词：冲击试验 滑移 受力分析 模拟仿真 试验测试 

分 类 号：TJ85[兵器科学与技术—武器系统与运用工程]