“后摩尔时代”芯片互连方法简析  

A Brief Introduction of the‘More than Moore Era’Chip Interconnection Method

作　　者：张墅野[1,2] 初远帆 李振锋 鲍俊辉 张雨杨 刘一甫 易庆鸿 崔澜馨 何鹏 ZHANG Shuye;CHU Yuanfan;LI Zhenfeng;BAO Junhui;ZHANG Yuyang;LIU Yifu;YI Qinghong;CUI Lanxin;HE Peng(State Key Laboratory of Advanced Welding and Joining,Harbin Institute of Technology,Harbin 150000,China;Key Laboratory of Science and Technology on Silicon Devices,Chinese Academy of Sciences,Beijing 100000,China)

机构地区：[1]哈尔滨工业大学先进焊接与连接国家重点实验室,哈尔滨150000 [2]中国科学院硅器件技术重点实验室,北京100000

出　　处：《材料导报》2023年第15期121-130,共10页Materials Reports

基　　金：中国科学院硅器件技术重点实验室开放基金(KLSDTJJ2022-5);国家重点研发计划(2020YFE0205300);重庆市自然科学基金(cstc2021jcyj-msxmX1002);中央高校基本科研业务费专项资金(AUGA5710051221);黑龙江省自然科学基金(YQ2022E024)。

摘　　要：随着半导体制程接近工艺物理极限,半导体工业进入“后摩尔时代”,集成技术成为继续提高电子产品性能的重要途径。现存的实现高度集成的关键技术都对更小尺寸的连接提出了要求。同时随着连接尺寸的减小,封装体在连接工艺中受到的影响导致器件在使用温度下失效的问题越来越严重。封装内的互连部分是芯片热传导、电气连接的重要结构,也是器件失效的重要部位,在互连接头尺寸不断减小的背景下,互连部分的失效在器件整体失效的情况中占据着越来越重要的地位,研究高导热、低工艺影响的微纳连接技术有望解决高功率密度器件的可靠性问题。本文总结了微纳连接技术在新型焊料、能量传递方式两方面的发展,简单介绍了表面活化技术并讨论其应用在电子封装中的可能性,在此基础上讨论了微纳连接技术的发展方向。With the semiconductor process approaching its physical limit,the semiconductor industry has gradually entered the‘More than Moore era’.Integrated technology is an important way to continue to improve the performance of electronic products.The key technologies to achieve high integration all require smaller size connections.With the decrease of connection size,the failure of devices at service temperature is beco-ming more and more serious due to the influence of the connection process on the package.Interconnection is an important way of chip heat conduction.Micro nano connection technology with high thermal conductivity and low process impact is expected to solve the reliability problem of high-power density devices.This paper summarizes the development of micro nano connection technology in new solders and energy transfer methods,briefly introduces the surface activation technology and discusses the possibility of its application in electronic packaging,and on this basis,briefly discusses the development direction of micro nano connection technology.

关 键 词：微纳连接 表面活化键合 低温焊料 纳米焊料 电子束辐照 超声连接 

分 类 号：TG4[金属学及工艺—焊接]