Interfacial reaction behavior and mechanical properties of 5A06 Al alloy soldered with Sn-1Ti-xGa solders at a low temperature  

作　　者：宋立志 肖勇 奚邦富 李佳琪 张建 Song Lizhi;Xiao Yong;Xi Bangfu;Li Jiaqi;Zhang Jian(School of Materials Science and Engineering,Wuhan University of Technology,Wuhan 430070,China;State Key Laboratory of Advanced Technology for Materials Synthesis and Processing,Wuhan University of Technology,Wuhan 430070,China)

机构地区：[1]School of Materials Science and Engineering,Wuhan University of Technology,Wuhan 430070,China [2]State Key Laboratory of Advanced Technology for Materials Synthesis and Processing,Wuhan University of Technology,Wuhan 430070,China

出　　处：《China Welding》2023年第2期23-31,共9页中国焊接（英文版）

基　　金：the National Natural Science Foundation of China(No.52171045).

摘　　要：Active soldering of 5A06 Al alloy was performed at 300 ℃ by using Sn-1Ti and Sn-1Ti-0.3Ga active solders, respectively. Theeffects of soldering time on the microstructure and mechanical properties of the joints were investigated. The results showed that the Sn-1Tisolder broke the oxide film on the surface of the Al substrate and induced intergranular diffusion in the Al substrate. When Ga was added tothe solder, severe dissolution pits appeared in the Al substrate due to the action of Sn-1Ti-0.3Ga solder, and many Al particles were flakedfrom the matrix into the solder seam. Under thermal stress and the Ti adsorption effect, the oxide film cracked. With increasing solderingtime, the shear strength of 5A06 Al alloy joints soldered with Sn-1Ti and Sn-1Ti-0.3Ga active solders increased. When soldered for 90 min,the joint soldered with Sn-1Ti-0.3Ga solder had a higher shear strength of 22.12 MPa when compared to Sn-1Ti solder.

关 键 词：5A06-Al alloy Sn-Ti-Ga solder low-temperature soldering interfacial reaction mechanical properties 

分 类 号：TG454[金属学及工艺—焊接]