基于双振镜组的微孔激光旋切加工系统  

Micro⁃Hole Laser Helical Drilling System Based on Double Galvanometer Groups

作　　者：龙宙 秦应雄 许文强 秦庆全 肖金陵 童杰 段光前 Long Zhou;Qin Yingxiong;Xu Wenqiang;Qin Qinquan;Xiao Jinling;Tong jie;Duan Guangqian(National Engineering Research Center for Laser Processing,School of Optical and Electronic Information,Huazhong University of Science and Technology,Wuhan 430074,Hubei,China;Jiangsu Xianhe Laser Technology Co.,Ltd.,Suqian 223800,Jiangsu,China)

机构地区：[1]华中科技大学光学与电子信息学院激光加工国家工程研究中心,湖北武汉430074 [2]江苏先河激光技术有限公司,江苏宿迁223800

出　　处：《中国激光》2023年第12期245-251,共7页Chinese Journal of Lasers

基　　金：宿迁市科技计划项目(H202009)。

摘　　要：为实现孔径和锥度可调的微孔加工,设计研制了一种基于双振镜组联动与Z轴上下移动的五轴四联动激光旋切系统。建立了微孔激光旋切物理模型,首先利用边缘轮廓确定微孔形状,再通过分层回型填充方法确定每个激光作用点的位置;然后基于聚焦光束不被遮挡和振镜偏转整体运动量少的原则,确定四个振镜的偏转角度;通过改变边缘轮廓端点数据,可分别实现方孔尺寸和锥度的灵活可控。采用15 W紫外皮秒激光器、两套相同的振镜和焦距为32 mm的远心透镜,配合三维平移工作台,搭建了激光旋切硬件系统,自主开发了多边形激光旋切控制软件。实验采用分层降焦打孔的方式,在厚度为250μm的氮化硅材料上实现了55μm×55μm规格的正锥、零锥、负锥方形微孔的加工,并且还实现了不同孔径(30~80μm)零锥方形微孔和三角形、五边形、六边形等其他形状微孔的加工。Objective Micro-hole structures are widely used in devices such as aerospace turbine blades,automotive engine injector nozzles,and probe cards.With the improvement of the device performance requirements,the requirements of diameter and taper for microholes are also further raised.Conventional micro-hole processing methods include electrical discharge machining(EDM)and electrochemical machining(ECM).The shape of micro-hole cannot be precisely controlled by EDM,and the micro-hole machining precision is unsatisfactorily controlled by ECM.The general laser drilling methods include single-pulse drilling,multi-pulse drilling,and circular drilling.In all three drilling methods,the focusing position of beam is only controlled,but the beam incidence attitude is not controlled,and there were taper problems for the micro-hole.As an upgrade,the helical drilling can control the diameter and taper of micro-hole by precisely controlling the beam incident position and focusing orientation during the processing procedure.The research on helical drilling and related processing equipment is mainly aimed at the circular hole processing,and the irregular microhole processing still needs to be further studied.To obtain the square holes with adjustable tapers and controllable hole diameters on probe card materials,relevant studies and experiments are conducted in this study.Methods A new type of laser helical drilling system is presented.The system is composed of four-axis galvanometer groups controlled by linkage and Z axis moving device controlled independently.The processing plane is divided into two directions(X and Y directions)by double galvanometer groups,and the beam focusing position and incident orientation in each direction are controlled by two galvanometers.The physical model of micro-hole laser helical drilling is established.First,a coordinate system is applied to the micro-hole,and the shape of the micro-hole is determined by the edge profile.Second,the micro-hole is processed by a layer-by-layer filling method,while th

关 键 词：激光技术 激光旋切 微孔加工 双振镜组 分层填充 锥度调节 

分 类 号：TN249[电子电信—物理电子学]