ENIG焊点微观组织与失效模式关系研究  

Research on the Relationship between Microstructure and Failure Mode of Solder Joint of ENIG

作　　者：王燕清 蒋庆磊[1] 王旭艳[1] 冯明祥 李欣欣 WANG Yanqing;JIANG Qinglei;WANG Xuyan;FENG Mingxiang;LI Xinxin(The 14th Research Institute of China Electronics Technology Corporation,Nanjing 210039,China)

机构地区：[1]中国电子科技集团公司第十四研究所,江苏南京210039

出　　处：《电子质量》2023年第7期50-55,共6页Electronics Quality

摘　　要：无铅有铅混装焊点可靠性问题是军工电子需面对的一个重要问题。随着板级电路组装密度的增大,化学镍金(ENIG)镀层工艺以其平整性好和可焊性好等优势而逐步地取代传统锡铅热风整平工艺。但无铅有铅/ENIG焊点的界面形貌、微观组织与可靠性的相互关系待进一步研究。从焊点界面微观组织、剪切强度、温度循环试验和振动试验等多个方面比较了Sn基焊料在ENIG焊盘和Cu焊盘上的差异,并结合实际案例分析ENIG焊点微观组织结构与Sn基焊料在ENIG焊盘上的脆性界面开裂、非典型黑盘故障和柯肯达尔空洞等多种失效模式的关联关系。The solder joint reliability of the mix alloy of lead and lead-free is an important issue for military electronics.With the increase of assembly density of plat level circuits,ENIG coating process has gradually replaced the traditional hot air smooting process with good flatness and weld ability.But the relationship between the interfacial morphology,microstructure and reliability of the solder joint of lead and lead-free/ENIG still needs to be further studied.The difference of Sn base solder on ENIG pad and Cu pad is compared from several aspects,such as microstructure,shear strength,temperature test and vibration test.Based on the case study,the relationship between the microstructure of ENIG solder joint and the brittle interface cracking,atypical black disk failure,Kirkendal cavity and other failure modes of Sn-based solder on ENIG pad is analyzed.

关 键 词：无铅有铅混装 化学镍金 Ni-Sn金属间化合物 微观组织 失效模式 

分 类 号：TG454[金属学及工艺—焊接]