A supersaturated Cu-Ag nanoalloy joint with ultrahigh shear strength and ultrafine nanoprecipitates for power electronic packaging  

作　　者：Wenwu Zhang Penghao Zhang Dashi Lu Hao Pan Xiangli Liu Chengyan Xu Jun Wei Mingyu Li Hongjun Ji 

机构地区：[1]The State Key Laboratory of Advanced Welding and Joining,School of Materials Science and Engineering,Harbin Institute of Technology at Shenzhen,Shenzhen 518055,China [2]Sauvage Laboratory for Smart Materials,School of Materials Science and Engineering,Harbin Institute of Technology(Shenzhen),Shenzhen 518055,China [3]Shenzhen Key Laboratory of Flexible Printed Electronics Technology,Harbin Institute of Technology(Shenzhen),Shenzhen 518055,China

出　　处：《Journal of Materials Science & Technology》2023年第14期56-65,共10页材料科学技术（英文版）

基　　金：This work was financially supported by the National Natu-ral Science Foundation of China(No.NSFC 51775140);A part of the work was also supported by the National Science and Technology Major Project(No.2017-VI-0009-0080);the Guangdong Province key research and development program(No.2019B010935001);the Shenzhen Science and Technology Plan(No.JCYJ20180507183511908);Bureau of Industry and Information Technology of Shenzhen through the Innovation Chain and Industry Chain(No.201806071354163490).

摘　　要：Ag-Cu bimetallic nanoalloy,integrating the advantages of reducing migration and cost of nano-Ag and alleviating oxidation of nano-Cu,is a prospective bonding material for power electronic packaging.The Ag-coated Cu nanoparticles(Cu@Ag NPs)paste can execute bonding with high quality at 250℃,and the achieved supersaturated Ag-Cu nanoalloy joint with ultrahigh shear strength(152 MPa)dramatically exceeds most nano-paste joints.The interstitial solid solutions with atomic-level metallurgical bonds at the interface dominantly promoted the shear strength.Besides,the numerous ultrafine nanograin,high proportion of low angle grain boundaries(7.44%)without deformation,and the Cu nanoprecipitates in the joint would improve subordinately.Furthermore,the high content(16.8%)of∑3 twin boundaries would contribute to the electrical and thermal conductivity.Thus,the multiple strengthening mechanisms with the solid solution,the second precipitated phase,and ultrafine nanograin can dramatically enhance shear strength and electro-thermal conductivity of joints for high-temperature device packaging.

关 键 词：Supersaturated Ag-Cu solid solution Cu nanoparticle precipitates Ultrafine nanograin Strengthening mechanism Electronic packaging 

分 类 号：TG146.11[一般工业技术—材料科学与工程] TB383.1[金属学及工艺—金属材料]