歧管微通道热沉研究进展与展望  

Development and Prospects of Manifold Microchannel Heat Sink Research

作　　者：朱迅仪 陈超伟 张井志[1] 辛公明[1] Zhu Xunyi;Chen Chaowei;Zhang Jingzhi;Xin Gongming(School of Energy and Power Engineering,Shandong University,Jinan,250061,China)

机构地区：[1]山东大学能源与动力工程学院,济南250061

出　　处：《制冷学报》2023年第4期15-33,共19页Journal of Refrigeration

基　　金：国家自然科学基金(U20A20300)资助项目;深圳市自然科学基金项目(JCYJ20190807092801669)资助。

摘　　要：随着电子设备的快速发展,其功率及热流密度急剧增加,对热管理的要求也越来越高。近年来出现了很多新兴的电子设备热管理技术,其中歧管微通道热沉由于其高散热能力、低压降损失以及高可靠性等优势被认为是最具前景的电子设备冷却技术之一。基于此,本文介绍了歧管微通道热沉的散热原理及优势,对几何参数、结构优化等方面的相关研究进行了回顾,并对其未来发展进行了展望。With rapid development of electronic devices,modern electronic devices require higher power and exhibit more heat flow density.Consequently,their thermal management requirements have increased drastically.Manifold microchannel heat sinks are considered as the optimal cooling technology for electronic devices due to their high heat dissipation capability,simplicity,and reliability.This paper describes the heat dissipation principles and advantages of manifold microchannel heat sinks and reviews relevant research about their geometrical parameters and optimal structures.It also provides an outlook on their future development.

关 键 词：电子设备冷却 液冷技术 歧管微通道 优化 

分 类 号：TB611[一般工业技术—制冷工程] TB657.5