高多层PCB非金属化孔粘金的原因分析与改善方案  

Root Cause Analysis and Improvement Action for Excessive Metal in NPTH of High Layer Count PCB

作　　者：付艺 向铖 Fu Yi;Xiang Cheng

机构地区：[1]珠海方正电路板发展有限公司-研究院,广东珠海519175

出　　处：《印制电路资讯》2023年第4期78-83,共6页Printed Circuit Board Information

摘　　要：非金属化孔粘金是化学镍金或镍钯金工艺的常见缺陷之一,会引起电路板可靠性风险。高多层PCB非金属化孔粘金的失效模式可分为4大类,包括孔壁铜蚀刻不净、钻孔孔壁粗糙、活化剂残留和除钯不净。高多层板的制作流程复杂多样,需要根据不同的失效模式结合制作流程制定相应的改善方案。本文总结了非金属化孔粘金的各种原因和改善措施,为PCB制造同行解决类似问题提供参考。Excessive metal in NPTH is one of the familiar defects in ENIG and ENIPIG processes,which will bring PCB reliability risk.There are 4 type of failure models with Excessive metal in NPTH of high layer count PCB including rough drilling hole wall,under etching in hole wall,catalyst residue and poor anti-palladium.Since the fabricating process of high layer count PCB is complex and different,it needs to take corresponding improvement actions based on the detail failure models and manufacturing process.This article summarizes the root causes and actions of various kinds of excessive metal in NPTH,and provides reference for PCB manufacturing peers to improve the same problem.

关 键 词：非金属化孔 非金属化孔粘金 电路板 化学镍金 失效模式 改善方案 

分 类 号：TN4[电子电信—微电子学与固体电子学]