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作 者:杨兆军[1] 李森 邹嘉佳[1] 李苗 程明生[1] YANG Zhaojun;LI Sen;ZOU Jiajia;LI Miao;CHENG Mingsheng(The 38th Research Institute of CETC,Hefei 230031,China)
机构地区:[1]中国电子科技集团公司第三十八研究所,合肥230031
出 处:《电子工艺技术》2023年第4期33-36,共4页Electronics Process Technology
摘 要:一种双极化天线需要同时完成水平极化微带板、垂直极化微带板、双联SMP连接器与金工件支架的低温钎焊。由于连接器的焊料量难以控制,造成钎透率不足,存在成品驻波不稳定、多发驻波超标的问题,需要返修才能提高合格率。通过焊料环的设计定制以及连接器的局部搪锡,优化焊料状态,使一次合格率由40%达到90%。A dual-polarized antenna module is monolithically low-temperature brazed and composited with the horizontal polarization microstrip laminate,vertical polarization microstrip laminates,double-inner conductor SMP connectors and the metal stent.Due to the difficulty in controlling the amount of solder in the connector,the soldering coverage is insufficient,resulting in unstable standing waves and multiple standing waves exceeding the standard in the finished product.Repair is needed to improve the qualification rate.By customizing the design of the solder ring and local tinning of the connector,the solder state is optimized,and the primary pass rate is increased from 40% to 90%.
分 类 号:TN82[电子电信—信息与通信工程]
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