多芯片高精度点胶贴片机技术发展趋势  

Technology Development Trend of Multi-chip High Precision Dispensing Mounter

作　　者：曹国斌 甘琨 田志峰 Cao Guobin;Gan Kun;Tian Zhifeng(The 2nd Research Institute of China Electronics Technology Group Corporation,Taiyuan Shanxi 030024,China)

机构地区：[1]中国电子科技集团公司第二研究所,山西太原

出　　处：《山西电子技术》2023年第4期105-107,共3页Shanxi Electronic Technology

摘　　要：基于多芯片高精度点胶贴片机应用背景,对目前国内市面主流的多芯片点胶贴片机从用户需求、技术指标差异进行分析,对未来多芯片高精度点胶贴片技术发展趋势做出分析研判。Based on the application background of multi-chiphigh-precision dispensing mounter,this paper analyzes the current mainstream multi-chip dispensing mounter in the domestic market from the user needs and technical index differences,and makes an analysis and judgment on the future development trend of multi-chip high-precision dispensing mounting technology.

关 键 词：多芯片 高精度 点胶贴片机 

分 类 号：TN705[电子电信—电路与系统]