潜伏性改性咪唑低温固化剂/环氧树脂体系的性能  

The Performance of a Latent Modified Imidazole Low Temperature Curing Agent/Epoxy Resin System

作　　者：王志远 陈刚 魏化震 王启芬 Wang Zhiyuan;Chen Gang;Wei Huazhen;Wang Qifen(Shandong Nonmetallic Materials Institute,Jinan 250031,China)

机构地区：[1]山东非金属材料研究所,济南250031

出　　处：《工程塑料应用》2023年第8期154-159,共6页Engineering Plastics Application

摘　　要：为探明一种新型潜伏性改性咪唑低温固化剂M-10用于固化高性能环氧树脂体系的性能,进一步在低温固化预浸料上的应用积累基础数据,采用差示扫描量热分析、动态热机械分析、浇注体力学性能测试等方法研究了固化剂用量及后处理温度对潜伏性低温固化环氧树脂体系的固化特性、力学性能、耐热性和室温适用期等性能的影响。结果表明,当固化剂用量为5%时,树脂体系短时间内无法实现低温快速固化;当固化剂用量为10%和20%时,树脂体系均可实现低温快速固化,经80℃/4 h固化和80℃/4 h的后处理工艺过程,固化度均能达到90%以上,已能够实现较高程度的固化,两者的力学性能及玻璃化转变温度(Tg)也基本保持相当。高温后处理工艺过程可使低温固化浇注体的Tg明显提高,力学性能提高不明显,甚至有所降低。当固化剂质量分数为10%时,固化工艺参数为80℃固化4 h并经170℃/4 h高温后处理,树脂体系具有最优的综合力学性能和耐热性,拉伸强度和Tg分别为48 MPa和140℃。该固化剂是一种性能优异的潜伏性低温固化剂,与环氧树脂混合后体系的室温适用期超过35 d,有望进一步应用于低温固化预浸料的制备。In order to investigate the performance of a new latent modified imidazole curing agent M-10 for curing high performance epoxy resin system,and to accumulate basic data for further application in low temperature curing prepreg,the effects of the content of the latent low-temperature curing agent M-10 and the post-treatment temperature on the curing properties,mechanical property,heat resistance and the pot life at room temperature of the epoxy resin system were studied by differential scanning calorimetry,dynamic thermomechanical analysis and test of mechanical properties of epoxy resin casting.The results show that the resin system can not achieve fast curing at low temperature in a short time when the content of the curing agent is 5%.When the curing agent content are 10%and 20%,the resin system can realize fast curing at low temperature.After curing at 80℃for 4 h and later post-treatment at 80℃for 4 h,a higher curing degree is more than 90%,and the mechanical properties and glass transition temperature(Tg)are basically the same.After high temperature post-treatment,Tg of the resin casting increases obviously,but the mechanical properties increase not obvious,or even decrease.The resin system with a curing agent content 10%,being cured at 80℃for 4 h and later post-treated at 170℃for 4 h has the best comprehensive mechanical properties and heat resistance,whose tensile strength and Tg are 48 MPa and 140℃,respectively.The curing agent M-10 is a kind of latent low temperature curing agent with excellent performance.After mixing with epoxy resin,the resin system has a pot life more than 35 days at room temperature,which is expected to be further applied to the preparation of low temperature curing prepreg.

关 键 词：潜伏性 低温固化 环氧树脂 力学性能 耐热性 

分 类 号：TQ32[化学工程—合成树脂塑料工业]