埋置异形铜块与含阶梯空腔的模块板工艺研究  

Research on the process of module board with special type buried coin and stepped cavity

作　　者：王红月 WANG Hongyue(Shanghai Meadville Electronics Company Limited,Shanghai 201100,China)

机构地区：[1]上海美维电子有限公司,上海201100

出　　处：《印制电路信息》2023年第8期24-28,29,共6页Printed Circuit Information

摘　　要：板载芯片封装(COB)是解决散热问题的一种技术。对一款含埋置异形铜块与阶梯空腔的COB模块板进行研究,根据异形铜块形状设计对应的压合叠构,保证异形铜块的嵌入;并通过电荷耦合器件(CCD)控深铣与CO_(2)激光铣组合的方式,实现铜块上方2种深度空腔的加工。最终产品的埋铜区域可靠性、阶梯空腔尺寸精度及平整性等关键指标均满足客户设计要求。Chip on board packaging is a technology to solve the problem of heat dissipation.In this paper,a COB module board with buried special coin and stepped cavity is studied.According to the shape of specialcoin,the corresponding lamination stack-up is designed,to ensure the embedding of special coin;through the combination of charge coupled device depth control milling and CO_(2) laser milling,machining of two kinds of deep cavity above the coin is realized.The key indicators of the final product,such as the reliability of the buried copper area,dimensional accuracy and flatness of the stepped cavity,all meet the design requirements of customers.

关 键 词：板载芯片封装 模块板 空腔 铜块 

分 类 号：TN41[电子电信—微电子学与固体电子学]