半导体塑封压机的自动化工艺技术应用  

Application of Automation Technology in Molding Press

作　　者：赵松 汪宗华 何成国 杨韬 曹玉堂 ZHAO Song;WANG Zonghua;HE Chengguo;YANG Tao;CAO Yutang(Wenyi Trinity Technology Co.,Ltd.,Tongling 244000,China)

机构地区：[1]文一三佳科技股份有限公司,安徽铜陵244000

出　　处：《电子工业专用设备》2023年第4期42-45,共4页Equipment for Electronic Products Manufacturing

摘　　要：为了解决人工操作重复性劳动、提升产品品质和提高效率,通过设计塑封压机自动化工艺流程,设计自动化子单元设备解决产品关键环节工艺问题,实现了塑封压机封装整个工艺流程的自动化;完成了从引线框架上料到封装产品收集装入弹夹整个工序流程自动化;完全实现了塑封压机MGP模自动化生产的工艺流程。In order to solve repetitive manual labor,improve product quality,and improve efficiency.By designing the automated process flow of the molding press and designing automated sub unit equipment to solve key process problems of the product,automation of the entire packaging process in molding press is achieved.Completed the automation of the entire process from loading the lead frame to collecting and loading the packaged product into the magazine.The automated production process of MGP mold for molding press is realized completely.

关 键 词：协作机器人 工艺流程 子单元 自动化 

分 类 号：TN305[电子电信—物理电子学]