集成电路封装设备翻转机构原理及控制方法  

Principle and Control Method of Reversing Mechanism of Integrated Circuit Packaging

作　　者：杨韬 汪瑞 汪宗华 宋春雷 赵松 曹玉堂 YANG Tao;WANG Rui;WANG Zonghua;SONG Chunlei;ZHAO Song;CAO Yutang(Tongling Fushi Sanjia Machine Co.,Ltd.,Tongling 244000,China)

机构地区：[1]铜陵富仕三佳机器有限公司,安徽铜陵244000

出　　处：《电子工业专用设备》2023年第4期46-48,70,共4页Equipment for Electronic Products Manufacturing

摘　　要：介绍了半导体集成电路中翻转机构的应用场景,分析了翻转机构的机械结构及原理,并对翻转机构的控制方法做进一步说明。为实现特种芯片(上塑封体、下散热片、管脚、基岛等)的稳定生产提供了一种可行性方案。This paper introduces the application of a turnover mechanism in semiconductor molding area,and analyses the mechanical structure and principle of this turnover mechanism,then gives further expalnatioin of its control method.To achieve stable production of some special electronic chips(such as upper-molded package,lower-heat sink structure,Pin,Paddle),this paper provides a feasible approach.

关 键 词：翻转 控制 集成电路 可行性 芯片 

分 类 号：TN305[电子电信—物理电子学]