基于抗高过载的印制电路板防护技术研究  

Research on Printed Circuit Boards Protection Technology based on High Overload Resistance

作　　者：马军伟[1] 刘娜娜 刘扬 赵瑞阳 杨心仪 MA Junwei;LIU Nana;LIU Yang;ZHAO Ruiyang;YANG Xinyi(Xi’an North Electro-optic Science Technology Defense Co.,Ltd.,Xi’an 710043,China)

机构地区：[1]西安北方光电科技防务有限公司,陕西西安710043

出　　处：《新技术新工艺》2023年第7期56-59,共4页New Technology & New Process

摘　　要：末制导炮弹在发射时会产生很大的轴向过载,要求制导产品的光、机件及电路板都要有耐高过载能力,电子器件和印制电路板是弹体系统的重要组成部分,其机械结构在冲击力的作用下要承受高过载。生产实际中,由于印制电路板无法承受高过载,导致产品损坏不能正常工作的现象屡见不鲜。因此,针对电路板元器件验收提出了DMAIC法,提高元器件自身质量;对产品微间距、高密度的电路板提出焊料预制和优化焊接过程预置强度的真空焊接技术,保证电路板焊接质量稳定;优化聚氨酯灌封材料配比,实现多电路板组合舱体灌封工艺提升,提高电路板强度,并从动力学角度研究炮射产品零部件间间隙的精密装调方法,从上述几方面实现单/多印制电路板抗高过载能力的全面提升。The terminal guided projectile would produce great axial overload when it was launched,which required that the light,mechanical parts and circuit boards of the guided product had the ability to withstand high overload.Electronic components and printed circuit boards were important components of the missile body system,and their mechanical structure must withstand high overload under the impact force.In production practice,it was common that the printed circuit boards could not withstand high overload,which resulted in product damage and could not work normally.Therefore,DMAIC method was proposed for the acceptance of circuit board components to improve the quality of components.The vacuum welding technology of solder prefabrication and optimization of welding process and preset strength was proposed for the circuit board with the micro-spaced and the high-density to ensure the welding quality.We optimized the filling and sealing material ratio of polyurethane to realize multi-circuit board assembly cabin sealing process improvement and circuit board strength.And we studied the assembly and adjustment method of the clearance between the parts of the gun-launched product from the perspective of dynamics,so as to improve the anti-high overload capability of single/multiple printed circuit boards from the above aspects.

关 键 词：印制电路板 高过载 DMAIC 焊接 灌封 装调 

分 类 号：D510.8[政治法律—政治学]