改性环氧树脂封装LED散热性能研究与优化  

Research and optimization of heat dissipation performance of modified epoxy resin encapsulated LED

作　　者：谢海情[1,2] 丁花 谢进 陈振华 崔凯月 XIE Haiqing;DING Hua;XIE Jin;CHEN Zhenhua;CUI Kaiyue(School of Physics and Electronic Science,Changsha University of Science and Technology,Changsha 410114,China;Hunan Provincial Key Laboratory of Flexible Electronic Materials Genome Engineering,Changsha University of Science and Technology,Changsha 410114,China)

机构地区：[1]长沙理工大学物理与电子科学学院,湖南长沙410114 [2]长沙理工大学柔性电子材料基因工程湖南省重点实验室,湖南长沙410114

出　　处：《现代电子技术》2023年第18期19-24,共6页Modern Electronics Technique

基　　金：湖南省自然科学基金(2021JJ30739);长沙市科技计划重点项目(kq1901102);2020年度湖南省教育厅科学研究项目(20K007)。

摘　　要：为降低LED结温,采用有限元方法对石墨烯/氧化石墨烯改性的环氧树脂封装LED散热特性进行数值仿真与分析研究,并通过优化LED封装结构进一步提高GR/EP封装LED的散热性能。结果表明,石墨烯/氧化石墨烯改性的环氧树脂封装LED均可以降低结温,且等量的石墨烯改性环氧树脂封装LED的散热效果优于氧化石墨烯的。通过对封装材料的半径和高度等结构参数进行优化设计,进一步提高GR/EP封装LED的散热性能。结果表明:在封装材料体积变化时,增大封装材料的半径和高度可有效降低LED结温,当封装材料半径为1.17 mm、高度为0.78 mm时,LED降温效果可达优化前的1.35倍;在LED封装材料体积不变的情况下,当封装材料半径为0.85 mm、高度为0.97 mm时,LED降温效果可达优化前的1.09倍。In order to reduce LED(light emitting diode)junction temperature,the finite element method is used to conduct numerical simulation and analysis on the heat dissipation characteristics of Graphene/Graphite oxide modified epoxy resin encapsulated LED,and further improve the heat dissipation performance of GR/EP encapsulated LED by optimizing the LED encapsulation structure.The results show that both Graphene/Graphene oxide modified epoxy resin encapsulated LEDs can reduce the junction temperature.The heat dissipation effect on graphene modified epoxy resin encapsulated LED is better than that of graphene oxide when using equal amount of modification materials.The thermal performance of the GR/EP encapsulated LEDs can be improved by optimizing the design of structural parameters such as radius and height of the encapsulation material.The results show that increasing the radius and height of the encapsulation material can effectively reduce the LED junction temperature when the volume of the encapsulation material varies.When the radius of the packaging material is 1.17 mm and the height is 0.78 mm,the LED cooling effect can reach 1.35 times that of the optimized one;When the volume of LED packaging material remains unchanged,the cooling effect of LED can reach 1.09 times that of before optimization when the packaging material radius is 0.85 mm and the height is 0.97 mm.

关 键 词：LED封装 改性环氧树脂 散热性能 石墨烯/氧化石墨烯 GR/EP封装 封装材料 

分 类 号：TN312.8-34[电子电信—物理电子学]