5,5-二甲基乙内酰脲配位体系中银的电沉积行为研究  

Electrodeposition Behavior of Silver in an Alkaline DMH Plating Bath with 5,5-Dimethylhydantoin as Complexing Agent

作　　者：陈惠敏 王帅星[1] 张骐 詹中伟 杜楠[1] CHEN Huimin;WANG Shuaixing;ZHANG Qi;ZHAN Zhongwei;DU Nan(School of Materials Science and Engineering,Nanchang Hangkong University,Nanchang 330063,China;Aviation Key Laboratory of Science and Technology on Advanced Corrosion and Protection for Aviation Material,AECC Beijing Institute of Aeronautical Materials,Beijing 100095,China)

机构地区：[1]南昌航空大学材料科学与工程学院,南昌330063 [2]中国航发北京航空材料研究院航空材料先进腐蚀与防护航空科技重点实验室,北京100095

出　　处：《中国腐蚀与防护学报》2023年第4期896-902,共7页Journal of Chinese Society For Corrosion and Protection

基　　金：江西省主要学科学术和技术带头人培养计划(20204BCJL23033);中国航空发动机集团产学研合作项目(HFZL2020CXY026);江西省研究生创新基金(YC2021-S654)。

摘　　要：选用5,5-二甲基乙内酰脲(DMH)作为配位剂进行电镀银,通过计时电位曲线、阴极极化曲线、电化学阻抗谱等分析了碱性DMH镀银体系中银的阴极还原过程,采用循环伏安曲线、计时电流法研究了银的成核/生长机制,综合探讨了碱性DMH镀银体系中银的电沉积行为。结果表明,碱性DMH镀银体系中,银配离子的主要存在形式为[Ag(C_(5)H_(7)N_(2)O_(2))_(2)]-,并且通过前置转化反应生成[Ag(C_(5)H_(7)N_(2)O_(2))]在阴极上直接放电。该体系中银的电沉积过程是由扩散控制的不可逆电极反应,且经历了晶核形成过程,并遵循三维瞬时成核生长机理。Electroplating silver is carried out in an alkaline DMH plating bath with 5,5-dimethylhydantoin(DMH)as complexing agent.The cathodic reduction process of silver from alkaline DMH plating bath is analyzed by chronopotentiometry,cathodic polarization curve and electrochemical impedance spectroscopy(EIS),meanwhile,the nucleation/growth mechanism of silver are also studied by cyclic voltammetry and chronoamperometry,finally the electrodeposition behavior of silver in alkaline DMH complex system is comprehensively discussed.The results show that the main form of silver complex ions in the alkaline DMH plating system is[Ag(C_(5)H_(7)N_(2)O_(2))_(2)]-,which is converted to[Ag(C_(5)H_(7)N_(2)O_(2))]through a preceding reaction and discharged directly on the cathode.The electrodeposition process of silver in this system is an ir-reversible electrode reaction controlled by diffusion step.Besides,the electrodeposition of silver undergoes a nucleation process and follows a three-dimensional transient nucleation mechanism.

关 键 词：5 5-二甲基乙内酰脲 银 电沉积 形核机理 

分 类 号：TG179[金属学及工艺—金属表面处理]