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作 者:杨贝松 赵进科 吴栋 YANG Beisong;ZHAO Jinke;WU Dong(CEPREI,Guangzhou 511300,China;Xian CEPREI Industrial Technology Research Institute Co.,Ltd.,Xian710300,China)
机构地区:[1]工业和信息化部电子第五研究所,广东广州511300 [2]西安赛宝工业技术研究院有限公司,陕西西安710300
出 处:《电子产品可靠性与环境试验》2023年第4期36-39,共4页Electronic Product Reliability and Environmental Testing
摘 要:介绍了一种软硬件综合可靠性试验方法,并以空空导弹为例给出其工程实践过程。首先,根据载机飞行剖面得到空空导弹工作过程中硬件综合应力剖面;其次,采用软件可靠性测试方法,对飞行作战剖面进行分析,得到软件使用剖面,根据软件使用剖面预估不同软件子任务剖面执行的概率,进一步分析用例执行次数;最后,根据剖面映射对软件、硬件可靠性剖面进行结合得到软硬件综合可靠性试验剖面。A method of software and hardware integrated reliability test is introduced,and its engineering practice process is given by taking air-to-air missible as an example.Firstly,the hardware integrated stress profile of the air-to-air missile is obtained based on the flight profile of the carrier.Secondly,the software usage profile is obtained by using the software reliability test method to analyze the flight combat profile.According to the software usage profile,the execution probability of different software subtask profiles is estimated to further analyze the execution times of use cases.Finally,the comprehensive reliability test profiles of software and hardware is obtained by combining the software and hardware reliability profiles according to the profile mapping.
分 类 号:TB114.3[理学—概率论与数理统计]
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