MGP模具封装树脂料阵列装载技术设计及应用  

Design and Application of Multiplc Gate Plunger Packaging Molding Compound Array Loading Technology

作　　者：赵松 汪宗华 Zhao Song;Wang Zonghua(Wenyi Trinity Technology,Tongling,Anhui 244000,CHN)

机构地区：[1]文一三佳科技股份有限公司,安徽铜陵244000

出　　处：《模具制造》2023年第9期32-34,共3页Die & Mould Manufacture

摘　　要：为了解决MGP模具封装人工手动装载树脂料,提高产品品质和生产效率,降低劳作强度,研究设计MGP模具封装树脂料阵列装载技术。通过料仓直线震动、圆盘振动筛选整列、进料直振振动,进入滑台阵列组,通过平面多夹爪机械手抓取树脂料投入料架料筒内,实现自动装载树脂料;通过阵列设置定位位置,设定参数简单、易操作。In order to solve the problem of manually loading molding compound for multiplc gate plunger packaging,improve product quality and efficiency,and reduce labor intensity,a loading technology formultiplc gate plunger packaging molding compound array is studied and designed.Through linear vibration of the silo,disc vibration screening of the entire row,and direct vibration of the feeding material,it enters the sliding table array group.The molding compound is grabbed by a planar multi gripper robotic arm and fed into the material rack and barrel,achieving automatic loading of the molding compound.By setting the positioning position through the array,setting parameters is simple and easy to operate.

关 键 词：树脂料 振动部件 阵列设置 

分 类 号：TQ320.66[化学工程—合成树脂塑料工业]