低介质损耗增韧剂的合成及应用研究  

Synthesis and application of low dielectric loss toughening agents

作　　者：李成武 邹静 周友 唐安斌[1,2] 马寒冰[1] LI Chengwu;ZOU Jing;ZHOU You;TANG Anbin;MA Hanbing(School of Materials Science and Engineering,Southwest University of Science and Technology,Mianyang 621000,China;National Insulating Material Engineering Research Center,Sichuan EM Technology Co.,Ltd.,Mianyang 621000,China)

机构地区：[1]西南科技大学材料科学与工程学院,四川绵阳621000 [2]四川东材科技集团股份有限公司国家绝缘材料工程技术研究中心,四川绵阳621000

出　　处：《绝缘材料》2023年第9期38-42,共5页Insulating Materials

摘　　要：本文设计合成了一种新型低介质损耗增韧剂(Si-DABPA),并对其结构进行表征,研究了其对马来酰亚胺(DFE950)的增韧效果。结果表明:Si-DABPA和二烯丙基双酚A(DABPA)对DFE950具有相同的反应活性,与DFE950/DABPA固化物相比,DFE950/Si-DABPA固化物的耐热降解性提高,10 GHz下介电常数(Dk)和介质损耗因数(Df)有所降低。与DFE950/DABPA/PPE固化物相比,DFE950/Si-DABPA/PPE固化物的拉伸强度提高,而弯曲强度和冲击强度变化不大。A novel low dielectric loss toughening agent(Si-DABPA)was designed and synthesized,and its structure was characterized,then its toughening effect on bismaleimide(DFE950)was studied.The results show that the Si-DABPA and diallyl bisphenol A(DABPA)have the same reactivity to DFE950.Compared with the DFE950/DABPA cured material,the Thermal degradation resistance of the DFE950/Si-DABPA cured material increases,and the dielectric constant(Dk)and dielectric loss factor(Df)decrease at 10 GHz.Compared with the DFE950/DABPA/PPE cured material,the tensile strenght of the DFE950/Si-DABPA/PPE cured material increases,while the bending strength and impact strength change little.

关 键 词：马来酰亚胺 二烯丙基双酚A 介质损耗因数 增韧剂 

分 类 号：TM215[一般工业技术—材料科学与工程]