干膜对减成法精细线路制作的影响  

Influence of Dry Film on Fine Line Processing by Subtraction Method

作　　者：李君红 LI Junhong(Shanghai Meadville Science&Technology Co.,Ltd.,Shanghai 201613,China)

机构地区：[1]上海美维科技有限公司,上海201613

出　　处：《电子工艺技术》2023年第5期34-36,50,共4页Electronics Process Technology

摘　　要：通过测试干膜的解析度/附着力、填充性以及图形转移的能力,提升减成法制作精细线路的水平。结果表明,两种干膜D1和D2在线宽/间距为1:1的解析度和附着力均可以达到8μm/8μm。干膜D1的填充性良好,当凹槽深度不大于7.7μm的情况下,回形线良率为100%;干膜D2的填充性低于干膜D1。通过DOE,发现对精细线路良率影响最大的是线宽/间距和线路的补偿值,其次是干膜的型号,干膜D1制作精细线路的良率高于干膜D2。最终选用D1干膜,采用最优参数完成20μm/20μm的精细线路的制作。The resolution/adhesion,conformation and pattern transfer of dry film are tested to improve the level of fine lines processing by subtractive method.The results show that the resolution and adhesion of D1and D2 of the two dry films can reach 8 μm/8 μm when Line/Space is 1:1.The conformation capacity of dry film D1 is good.When the depth of dent is less than 7.7 μm,the yield of return line is 100%.The conformation capacity of dry film D2 is lower than that of dry film D1.By DOE experiment,it is found that line width/spacing and line compensation value have the greatest influence on the yield,followed by the type of dry film.The yield of fine line production by dry film D1 is higher than that by dry film D2.Finally,D1 dry film is selected to finish the fine line production with the optimal parameters of 20 μm/20 μm..

关 键 词：减成法 干膜 解析度 附着力 线宽 间距 

分 类 号：TN605[电子电信—电路与系统]