导电银浆流变特性对丝网印刷填孔质量的影响  

Effect of Rheological Properties of Conductive Silver Paste on the Quality of Hole Filling in Screen Printing

作　　者：林亚梅 张志伟 朱思新 王志华 徐鹏飞 LIN Yamei;ZHANG Zhiwei;ZHU Sixin;WANG Zhihua;XU Pengfei(Shenzhen Zhenhuafu Electronics Co.,Ltd.,Shenzhen 518000,China)

机构地区：[1]深圳振华富电子有限公司,广东深圳518000

出　　处：《电子工艺技术》2023年第5期42-45,共4页Electronics Process Technology

摘　　要：金属化通孔工艺是低温共烧陶瓷微波元件加工过程中的关键技术,直接影响着元件内部不同层之间电气连接的可靠性。对于采用丝网印刷实现填孔的方式而言,影响通孔填充质量的因素除网版、印刷工艺参数之外,很大程度上取决于导电银浆的特性。从导电银浆流变特性出发,分析了电子浆料触变性、黏度对浆料印刷填孔质量的影响。研究表明较好触变性和适当黏度的导电银浆能够明显提高印刷填孔质量,通孔填充饱满,烧结后金属化通柱无凹陷或凸起和孔洞。这一研究结果可有效指导低温共烧陶瓷薄膜丝网印刷金属化通孔的质量改善。Metallized through-hole technology is the key technology in the processing of Low-temperature co-fired ceramic microwave components,which directly affects the reliability of electrical connection between different layers in LTCC microwave components.For the way of filling holes by screen printing,the factors that affect the filling quality of through holes,in addition screen printing□the printing process parameters,largely depend on the quality of conductive silver paste.Based on the rheological properties of conductive silver paste,the influence of the thixotropy and viscosity of the electronic paste on the quality of hole filling in paste printing is analyzed.It is found that the conductive silver paste with good thixotropy and proper viscosity can significantly improve the quality of hole filling in printing,and the hole filling is full.After sintering,the metallized column has no depression or bulge and hole.This results can effectively guide the quality improvement of metallized through-hole of low-temperature co-fired ceramic screen printing.

关 键 词：低温共烧陶瓷技术 薄膜丝网印刷 导电银浆 填孔质量 

分 类 号：TN605[电子电信—电路与系统]