基于离散元方法的墙地砖单磨粒磨削工艺参数的研究  

Single Abrasive Grinding Parameters of Wall and Floor Tiles Based onDiscrete Element Method

作　　者：韩文 高绪 黄军 吴文华 HAN Wen;GAO Xu;HUANG Jun;WU Wenhua(Jingdezhen Ceramic University,Jingdezhen 333403,Jiangxi,China;Guangdong Nade New Materials Co.,Ltd,Guangdong,Zhaoqing 526238,Guangdong,China;Zhejiang Shangguijuli Special Material Technology Co.,Ltd,Huzhou 313002,Zhejiang,China)

机构地区：[1]景德镇陶瓷大学,江西景德镇333403 [2]广东纳德新材料有限公司,广东肇庆526238 [3]浙江上硅聚力特材科技有限公司,浙江湖州313002

出　　处：《陶瓷学报》2023年第4期786-791,共6页Journal of Ceramics

基　　金：中国陶瓷产业发展基金。

摘　　要：由于墙地砖的侧边在烧结后会出现不可控变形,常常采用磨边方式来保证其严格的尺寸要求。采用离散元方法对墙地砖磨边磨粒的磨削工艺参数(磨边深度、前进速度和旋转速度)进行研究,着重分析了磨削工艺参数的改变对磨削力的影响。结果表明,磨边深度增加,磨削力增大。当深度为10μm时去除方式为韧性去除;当深度大于10μm时,转变为脆性去除。前进速度对磨削力大小影响较小,当前进速度大于90πrad·s-1时,去除更高效。旋转速度对磨削力几乎没有影响。磨削过程中磨削力影响磨削面的磨削质量,通过研究工艺参数对磨削力的影响获得了合理的工艺参数。Since the side edges of wall and floor tiles will be uncontrollably deformed after sintering,the edging method is often used to ensure their strict dimensional requirements.The grinding parameters(grinding depth,forward speed and rotation speed)of the edge grinding grains of wall and floor tiles were studied by using discrete element method,where the influence of the grinding parameters on the grinding force was analyzed.It is demonstrated that the grinding force is increased with increasing grinding depth.When the depth is 10μm,the removal behavior is ductile type,while it is converted to brittle one,as the depth is greater than 10μm.The advance speed has a weak effect on the grinding force.When it is greater than 90πrad·s−1,the removal is the most efficient.The effect of speed of rotation on the grinding force is also not pronounced.The grinding force in the grinding process directly affects the grinding quality of the grinding surface.This study can be used as a reference to select reasonable process parameters.

关 键 词：离散元 单磨粒 墙地砖磨边 磨削力 

分 类 号：TQ174.5[化学工程—陶瓷工业]