高电流测试对激光孔可靠性确认的应用研究  

Applied research on the high current testing on laser hole reliability confirmation

作　　者：金立奎 严志豪 谢家星 JIN Likui;YAN Zhihao;XIE Jiaxing(Zhuhai Founder Technology Gaomi Electronics Co.,Ltd.,Zhuhai 519090,Guangdong,China)

机构地区：[1]珠海方正科技高密电子有限公司,广东珠海519090

出　　处：《印制电路信息》2023年第9期44-48,共5页Printed Circuit Information

摘　　要：目前,印制电路板(PCB)厂大多通过高电流测试(HCT)设备对激光孔底部开裂风险进行监控。在实际生产中,偶尔会有HCT测试板经高电流测试时未出现异常,但在组装使用中个别测试板因激光孔底部开裂,导致电子产品功能异常的情况发生。针对盲孔孔径、盲孔节距及盲孔数3种因子设计不同类型的HCT附连测试板进行测试,分析同叠构不同设计测试板在经高电流测试时的差异情况,得出影响HCT附连测试板测试结果的设计因素及测试条件,供同行参考。At present,most printed circuit board(PCB)factories use high current test(HCT)equipment to monitor the risk of cracking at the bottom of laser hole.In the actual production,occasionally,HCT coupons did not exhibit abnormal when tested by high current,but in the use of products assembled by the same batch of circuit boards,some test boards were cracked at the bottom of the laser perforation,resulting in abnormal electronic products.In this paper,different types of HCT coupons are designed for testing based on three factors:blind hole aperture,blind hole pitch and number of blind holes.By analyzing the differences of HCT coupons of different designs in the same overlap through HCT,the design factors and testing conditions affecting the test results of HCT coupons are obtained for reference by peers.

关 键 词：高电流测试 高阶高密度互连 激光孔底部开裂 附连测试板 

分 类 号：TM201[一般工业技术—材料科学与工程]