Microstructure and shear properties evolution of Mn-doped SAC solder joint under isothermal aging  

作　　者：Cheng-ming Li Shu-jin Chen Shan-shan Cai Ju-bo Peng Xiao-jing Wang Ying-wu Wang 

机构地区：[1]School of Material Science and Engineering,Jiangsu University of Science and Technology,Zhenjiang 212003,Jiangsu,China [2]R&D Center,Yunnan Tin Group(Holding)Co.,Ltd.,Kunming 650000,Yunnan,China [3]Modern School of Engineering,Yunnan University,Kunming 650091,Yunnan,China

出　　处：《Journal of Iron and Steel Research International》2023年第8期1650-1660,共11页

基　　金：support received from Yunnan Fundamental Research Projects(Grant No.202101BC070001-007);the Jiangsu Province Industry-University-Research Cooperation Project(No.BY2022832);the National Natural Science Foundation of China(No.52275339).

摘　　要：The effects of Mn addition(0.005,0.01,0.03,0.05,and 0.07 wt.%)on microstructure,shear mechanical behavior,and interfacial thermal stabilities of SAC305 joints were investigated under isothermal aging temperatures of 170 C with different aging time(0,250,500,and 750 h).It is found that Mn addition can increase fracture energy of joints without decreasing the shear strength.And the microstructures have transformed from the eutectic net-like structure in SAC305 solder joints into the structures based onβ-Sn matrix with intermetallic compounds(IMCs)distributed.By doping 0.07 wt.%Mn,the Cu_(6)Sn_(5) growth along the SAC305/Cu interface during thermal aging can be inhibited to some extent.During isothermal aging at 170°C,the maximum shear force of solder joint decreases continuously with aging time increasing,while the fracture energy rises first and then decreases,reaching the maximum at 500 h compared by that with the microstructure homogenization.Cu_(3)Sn growth between Cu_(3)Sn_(5)/Cu interface has been retarded most at the aging time of 250 h with 0.07 wt.%Mn-doped joints.With the aging time prolonging,the inhibition effect of Mn on CusSn IMC layer becomes worse.The strengthening effect of Mn can be explained by precipitation strengthening,and its mechanical behavior can be predicted by particle strengthening model proposed by Orowan.

关 键 词：SAC305 solder Mn doping Shear mechanical behavior Isothermal aging Interfacial intermetallic compound 

分 类 号：TG14[一般工业技术—材料科学与工程]