铜、锌离子浓度比对羟基乙叉二膦酸体系电镀黄铜的影响  

Effect of Cu^(2+)/Zn^(2+)concentration ratio on brass electroplating from 1-hydroxyethylidene-1,1-diphosphonic acid-based bath

作　　者：袁景追 喻岚 陈惠敏 陈宝来 李能 刘瑞祥 王帅星[2] 杜楠[2] YUAN Jingzhui;YU Lan;CHEN Huimin;CHEN Baolai;LI Neng;LIU Ruixiang;WANG Shuaixing;DU Nan(AECC Guizhou Honglin Aero-engine Control Technology Corporation Ltd.,Guiyang 550009,China;School of Materials Science and Engineering,Nanchang Hangkong University,Nanchang 330063,China)

机构地区：[1]中国航发贵州红林航空动力控制科技有限公司,贵州贵阳550009 [2]南昌航空大学材料科学与工程学院,江西南昌330063

出　　处：《电镀与涂饰》2023年第17期1-7,共7页Electroplating & Finishing

基　　金：中国航空发动机集团产学研合作项目(HFZL2020CXY026)。

摘　　要：以羟基乙叉二膦酸(HEDP)为配位剂进行电镀黄铜(Cu–Zn合金),通过阴极极化测试、循环伏安分析、扫描电镜(SEM)观察、X射线衍射(XRD)等手段研究了Cu^(2+)/Zn^(2+)浓度比对电沉积过程及镀层微观结构的影响。结果表明,HEDP体系中Cu–Zn合金电沉积的电位介于Cu和Zn之间。随Cu^(2+)/Zn^(2+)浓度比减小,Cu–Zn合金的初始沉积电位正移,共沉积得到促进,镀层的Zn质量分数增大。Cu^(2+)/Zn^(2+)浓度比为1:4时所得Cu–Zn合金镀层为金黄色,微观上呈均匀分布的胞状结构,镀层中Cu的质量分数在65%~70%之间,与氰化物电镀黄铜的组成最接近。Brass(Cu–Zn alloy)electroplating was carried out with 1-hydroxyethylidene-1,1-diphosphonic acid(HEDP)as complexing agent.The effect of Cu^(2+)/Zn^(2+)concentration ratio on the electrodeposition process and microstructure of deposit was studied by cathodic polarization measurement,cyclic voltammetry,scanning electron microscopy(SEM),and X-ray diffraction(XRD).The results showed that the electrodeposition potential of Cu–Zn alloy was between the deposition potentials of Cu and Zn.With the decreasing of the concentration ratio of Cu^(2+)to Zn^(2+),the initial deposition potential of Cu–Zn alloy shifted toward a positive direction,which indicated that the codeposition of Cu–Zn alloy was promoted,resulting in an increase of zinc content in the deposit.The Cu–Zn alloy coating electrodeposited at a Cu^(2+)/Zn^(2+)concentration ratio of 1:4 was golden yellow,exhibited a uniformly distributed cellular structure microscopically,and contained 65%to 70%by mass of Cu,which was close to the composition of Cu–Zn alloy coating electrodeposited from a cyanide-containing bath.

关 键 词：电镀黄铜 羟基乙叉二膦酸 铜锌离子浓度比 阴极极化 微观结构 

分 类 号：TG174.453[金属学及工艺—金属表面处理]