柔性触控屏模组材料选型、模拟及DOE验证  

Selection,Simulation and DOE Verification of Flexible Touch Panel Module Materials

作　　者：白碧海 曹春燕 黄倪慧 陈子军 谢安 BAI Bihai;CAO Chunyan;HUANG Nihui;CHEN Zijun;XIE An(Fujian Key Laboratory of Functional Materials and Applications,Xiamen 361024,China;School of Materials Science&Engineering,Xiamen University of Technology,Xiamen 361024,China)

机构地区：[1]福建省功能材料及应用重点实验室,福建厦门361024 [2]厦门理工学院材料科学与工程学院,福建厦门361024

出　　处：《厦门理工学院学报》2023年第3期26-32,共7页Journal of Xiamen University of Technology

基　　金：厦门市重大科技项目(3502ZCQ20201001)。

摘　　要：为帮助研究人员更快地确定最佳的材料和结构设计方案,以缩短研发周期,降低研发成本,实现柔性触控屏模组具体商业量产应用目标,进行触控显示模组关键材料数据收集、力学模拟分析,并开展DOE(design of experiment)验证。测试3种不同触控屏(touch panel,TP)基材薄膜的屈服极限,结合目前市场量产材料和生产可行性,通过软件仿真分析材料极限弯折半径,发现透明聚酰亚胺薄膜(clear polyimide,CPI)具有最佳的可耐弯折性能,为最优的TP基材;不同厂家生产的CPI和光学透明胶材(optically clear adhesive,OCA)的测试比较结果显示,CPI(A)和OCA(4)具有最佳的弯折性能;CPI-OCA-CPI三合一叠构的DOE验证分析表明,最佳柔性触控屏模组材料组合为CPI(A)\OCA(4)\CPI(A)。To help researchers efficiently determine the best material and structure design scheme to reduce the cycle and cost of research and development to achieve the specified target of commercial mass production application of flexible touch panel(TP)module,The key material data collection,mechanical simulation analysis and DOE(design of experiment)verification of the touch panel module were carried out.Three different TP substrate films were analyzed,and their yield limits tested.Availability of the materials from mass production and production feasibility was considered,and the ultimate bending radius of materials was simulated and analyzed by software.The results show respectively that CPI(clear polyimide)has the best bend resistance and is the best substrate for touch layer;CPI(A)and OCA(4)have the best bending performance by tests comparing CPI and OCA(optically clear adhesives)from different manufacturers;the best material combination for the flexible TP module is CPI(A)\OCA(4)\CPI(A)by DOE verification analysis of the CPI-tests comparing CPI and OCA(optically clear adhesives)from different manufacturers;the best material combination for the flexible TP module is CPI(A)\OCA(4)\CPI(A)by DOE verification analysis of the CPI OCA-CPI triple stack.

关 键 词：柔性触控屏 模组 材料选型 仿真分析 DOE验证 

分 类 号：TB34[一般工业技术—材料科学与工程] O484.2[理学—固体物理]