片上光互连器件的智能化设计研究进展  

Research progress of intelligent design of on-chip optical interconnection devices

作　　者：杜特 马汉斯 姜鑫鹏 赵芬 张兆健 王志成 彭政[1,4] 张伊祎 张煜青 罗鸣宇 邹宏新 吴加贵[4] 闫培光[6] 朱刚毅[7] 于洋[1] 何新 陈欢[1] 张振福 杨俊波[1] Du Te;Ma Han-Si;Jiang Xin-Peng;Zhao Fen;Zhang Zhao-Jian;Wang Zhi-Cheng;Peng Zheng;Zhang Yi-Yi;Zhang Yu-Qing;Luo Ming-Yu;Zou Hong-Xin;Wu Jia-Gui;Yan Pei-Guang;hu Gang-Yi;Yu Yang;He Xin;Chen Huan;Zhang Zhen-Fu;Yang Jun-Bo(College of Science,National University of Defense Technology,Changsha 410073,China;College of Computer,National University of Defense Technology,Changsha 410073,China;School of Artificial Intelligence,Chongqing University of Technology,Chongqing 400054,China;College of Artificial Intelligence,Southwest University,Chongqing 400715,China;School of Computer,Electronic and Information,Guangxi University,Nanning 530004,China;College of Physics and Optoelectronic Engineering,Shenzhen University,Shenzhen 518060,China;School of Communication and Information Engineering,Nanjing University of Posts and Telecommunications,Nanjing 210023,China)

机构地区：[1]国防科技大学理学院,长沙410073 [2]国防科技大学计算机学院,长沙410073 [3]重庆理工大学两江人工智能学院,重庆400054 [4]西南大学人工智能学院,重庆400715 [5]广西大学计算机与电子信息学院,南宁530004 [6]深圳大学物理与光电工程学院,深圳518060 [7]南京邮电大学通信与信息工程学院,南京210023

出　　处：《物理学报》2023年第18期46-74,共29页Acta Physica Sinica

基　　金：国家自然科学基金(批准号:60907003,61805278,12272407,62275269,62275271);国家重点研发计划(批准号:2022YFF0706005);中国博士后科学基金(批准号:2018M633704);国防科技大学科研计划(批准号:JC13-02-13,ZK17-03-01);湖南省自然科学基金(批准号:13JJ3001);新世纪高校优秀人才计划(批准号:NCET-12-0142)资助的课题。

摘　　要：光互连技术相比于电互连等传统通信技术具有带宽大、能耗低、抗干扰等系列优势,正在逐渐成为短距离、甚短距离数据终端间通信的重要手段和发展趋势.基于绝缘体上硅的片上光互连技术作为光互连在芯片尺度上的实现,在一系列复用技术的支持下得到了非常广泛的应用.智能设计方法具有原理直观、设计自由度高、材料兼容性好等优点.随着智能设计方法在片上光互连器件设计活动中的广泛应用,目前片上光互连器件逐渐呈现出超紧凑化、可调控化、系统集成化等重要发展趋势.本文首先归纳了几种目前最常用的片上光互连器件的智能设计方法,然后详细分析了智能化设计的片上光互连器件的几个重大研究进展与趋势,最后对未来智能化设计的片上光互连器件的发展进行了展望.Compared with traditional communication technologies such as electrical interconnection,optical interconnection technology has the advantages of large bandwidth,low energy consumption,anti-interference,etc.Therefore,optical interconnection is becoming an important approach and development trend of short distance and very short distance data terminal communication.As the chip level optical interconnection is implemented,silicon on insulator(SOI)based on-chip optical interconnection has been widely utilized with the support of a series of multiplexing technologies.In recent decades,many on-chip optical interconnection devices have been developed by using conventional design methods such as coupled-mode,multimode interference,and transmission line theories.However,when used in device design,these conventional methods often face the problems such as complex theoretical calculations and high labor costs.Many of the designed devices also encounter the problems of insufficient compactness and integration,and single function.Intelligent design method has the advantages such as pellucid principle,high freedom of optimization,and good material compatibility,which can solve the problems of conventional design methods to a large extent.With the widespread use of intelligent design methods in the design of on-chip optical interconnection devices,three main trends have emerged.Firstly,the size of on-chip optical interconnect device is gradually developing towards ultra compact size.Secondly,the number of intelligently designed controllable on-chip optical interconnect devices is increasing.Thirdly,on-chip optical interconnect devices are gradually developing towards integration and systematization.This paper summarizes the most commonly used intelligent design methods of photonic devices,including intelligent algorithms based intelligent design methods and neural networks based intelligent design methods.Then,the above three important research advances and trends of intelligently designed on-chip optical interconnection device

关 键 词：片上光互连器件 智能设计方法 相变材料 光子集成回路 

分 类 号：TN929.1[电子电信—通信与信息系统] TN47[电子电信—信息与通信工程]