超长线列红外探测器组件的低温面形研究  

Study on Low-Temperature Profile of Ultra-Long Line Array Infrared Detector Assembly

作　　者：张璐 付志凯[1] 刘伟[1] ZHANG Lu;FU Zhi-kai;LIU Wei(The 11st Research Institute of China Electronics Technology Group Corporation,Beijing 100015,China)

机构地区：[1]中国电子科技集团公司第十一研究所,北京100015

出　　处：《红外》2023年第9期16-22,共7页Infrared

摘　　要：随着红外焦平面探测器阵列规模的不断扩大,由多层结构低温热失配形变导致的杜瓦可靠性问题愈发突出,对焦面低温形变的定量化表征需求越来越迫切。基于超长线列红外焦平面探测器冷箱组件开展焦面低温形变研究,针对多层结构粘接造成的焦面低温形变进行了理论仿真。设计了一种探测器工作温度90 K下焦面低温形变的测试方法。对比分析面形测试结果与仿真计算,低温下焦面整体下移,但变形曲线呈拱形。仿真得出两边芯片向下凹约9.24μm,中间位置芯片向下凹1.36μm。实验得出两边芯片向下凹约40μm,中间位置芯片向下凹10μm。数据差异与仿真材料的参数设置有关。验证了仿真结果的合理性,可为超长线列探测器焦面多层结构设计提供参考依据。With the continuous expansion of the array size of infrared focal plane detectors,the reliability failure of dewar caused by low-temperature thermal mismatch deformation of multi-layer structures is becoming increasingly prominent,and the demand for quantitative characterization of low-temperature deformation of the focal plane is becoming increasingly urgent.Based on the cold box component of the ultra-long linear infrared focal plane detector,a study was conducted on the low-temperature deformation of the focal plane,and theoretical simulation was conducted on the low-temperature deformation of the focal plane caused by multi-layer structure bonding.A test method for low temperature deformation of the focal plane of the detector at a working temperature of 90 K was designed.The results of the surface shape test were compared and analyzed with simulation calculations.The overall focal plane moved downward at low temperature,but the deformation curve was arched.The simulation showed that the chips on both sides were concave downward by about 9.24 m.In the middle position,the chip was concave downward by 1.36 m.The experimental results showed that the chips on both sides were concave downwards by about 40 m,and in the middle position,the chip was concave by 10 m.The data difference was related to the parameter setting of simulation materials.The rationality of the simulation results has been verified,which can provide a reference basis for the design of the focal plane multi-layer structure of ultra-long line array detectors.

关 键 词：低温形变 理论仿真 面形测试 材料参数 红外焦平面探测器 

分 类 号：TB133[机械工程—光学工程]